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Experimental Analysis of the Process of Anodic Bonding using an Evaporated Glass Layer

Published online by Cambridge University Press:  15 February 2011

W. B. Choi ,
B. K. Ju ,
Y. H. Lee ,
M. R. Haskard ,
S. J. Jeong ,
N. Y. Lee ,
M. Y. Sung  and
M. H. Oh
W. B. Choi
Affiliation:
Div. Electronics and Information Technology, KIST, P.O.Box 131, Cheongryang, 130–650, Seoul, Korea, bkju@willow.kist.re.kr
B. K. Ju
Affiliation:
Div. Electronics and Information Technology, KIST, P.O.Box 131, Cheongryang, 130–650, Seoul, Korea, bkju@willow.kist.re.kr
Y. H. Lee
Affiliation:
Div. Electronics and Information Technology, KIST, P.O.Box 131, Cheongryang, 130–650, Seoul, Korea, bkju@willow.kist.re.kr
M. R. Haskard
Affiliation:
Microelectronics Centre, Univ. of South Australia, S.A., 5098, Australia
S. J. Jeong
Affiliation:
Information Display Research Institute, Orion Electric Co.
N. Y. Lee
Affiliation:
Information Display Research Institute, Orion Electric Co.
M. Y. Sung
Affiliation:
Department of Electrical Engineering, Korea Univ., Seoul, Korea
M. H. Oh
Affiliation:
Div. Electronics and Information Technology, KIST, P.O.Box 131, Cheongryang, 130–650, Seoul, Korea, bkju@willow.kist.re.kr
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Abstract

A silicon-to-silicon anodic bonding process using a glass layer deposited by electron beam evaporation will be described. Corning #7740 Pyrex glass was used the source material of electron evaporation. From Auger electron spectroscopy (AES), the composition of the deposited glass layer is nearly same as that of the bulk Pyrex glass plate. Wafers are bonded at a temperature as low as 135 °C with an applied voltage as small as 35Vdc, enabling of this technique to be applied to vacuum packaging of microelectronic devices. Experimental results reveal that an evaporated glass layer of more than 1 μ m thick is suitable for anodic bonding. Finally, The role of sodium ions in anodic bonding was also studied by investigating the theoretical bonding mechanism and examining the results of secondary ion mass spectroscopy (SIMS) analysis.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 444: Symposium I – Materials for Mechanical and Optical Microsystems , 1996 , 173
Copyright
Copyright © Materials Research Society 1997

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References

1 Lasky, J.B., Appl. Phys. Lett., 48 (1986) 78–80.Google Scholar
2 Maszara, W.P., Goetz, G., Cavigilia, and McKitterick, J.B., J. Appl. Phis., 64 (1988) 4943–4950.Google Scholar
3 Bengtsson, S. and Engstrom, O., J. Appl. Phis., 66 (1989) 1231–1239.Google Scholar
4 Tiensuu, A.L., Bexell, M., Smith, L. and Johansson, S., Sensors and Actuators A 45, (1994) 227–236.Google Scholar
5 Nese, M. and Hanneborg, A., polysilicon or nitride, Sensors and Actuators A, (1993) 61–67.Google Scholar
6 Wallis, G. and Pomerantz, D.I., J. Appl. Phys., 40 (1969) 3946–3949.Google Scholar
7 Wallis, G., Electrocom. Sci. and Technol., 2 (1975) 45–53.Google Scholar
8 Jiao, J., Lu, D., Xiong, B. and Wang, W., Sensors and Actuators A, (1995) 117–122.Google Scholar
9 Stengl, R., Jpn. J. Appl. Phys., (1988) 2364–2366.Google Scholar
10 Brooks, A.A. and Donovan, R.P., J. Electrochem. Soc, 119 (1972) 545–546.Google Scholar
11 Ko, W.H., Suminto, J.T. and Yeh, G.J., Micromachining and Micropackaging of Trans. (1985) 41–61.Google Scholar
12 Hanneborg, A., Nese, M. and Ohlchers, P., Micromech. Microeng., 1 (1991) 139–144.Google Scholar
13 Esashi, Masayoshi and Nakano, Akira, Sensors and Actuators, A21–A23 (1990) 931–934.Google Scholar