Hostname: page-component-cd9895bd7-gxg78 Total loading time: 0 Render date: 2024-12-27T11:49:20.112Z Has data issue: false hasContentIssue false
  • English
  • Français

Exploration of Ternary Subsystems of Superalloys by High-Throughput Thin Film Experimentation: Optical and Electrical Data of the Co-Al-W System

Published online by Cambridge University Press:  04 February 2015

Dennis Naujoks ,
Dennis Koenig  and
Alfred Ludwig
Dennis Naujoks
Affiliation:
Institut für Werkstoffe, Ruhr-Universität Bochum, 44780 Bochum, Germany
Dennis Koenig
Affiliation:
Institut für Werkstoffe, Ruhr-Universität Bochum, 44780 Bochum, Germany
Alfred Ludwig
Affiliation:
Institut für Werkstoffe, Ruhr-Universität Bochum, 44780 Bochum, Germany
Get access

Abstract

The complete ternary system Co-Al-W was fabricated as a thin film materials library by combinatorial magnetron sputtering. The materials library was investigated using high-throughput characterization methods such as optical measurements as well as automated resistance screening. The obtained data indicate possible phase regions and compositional regions which show early surface oxidation. The demonstrated approach illustrates that using high-throughput measurement methods provides a fast access to data of relatively unexplored materials systems. The gained data provides a valuable basis for further in-depth studies of the investigated materials systems.

Keywords

combinatorial synthesisthin filmelectrical properties
Type
Articles
Information
MRS Online Proceedings Library (OPL) , Volume 1760: Symposium YY – Advanced Structural and Functional Intermetallic-Based Alloys , 2015 , mrsf14-1760-yy05-19
Copyright
Copyright © Materials Research Society 2015 

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

Ludwig, A., Zarnetta, R., Hamann, S., Savan, A., Thienhaus, S.: Development of multifunctional thin films using high-throughput experimentation methods, International Journal of Materials Research, Vol. 99, No. 10, pp. 1144–1149, (2008)Google Scholar
Hamann, S., Savan, A., Thienhaus, S., Ludwig, A.: Combinatorial Development of Fe-Pd-Mn Ferromagnetic Shape Memory Thin Films, ACTUATOR (2008)Google Scholar
Sato, J., Omori, T., Oikawa, K., Ohnuma, I., Kainuma, R., Ishida, K.: Cobalt-Base High-Temperature Alloys, Science Vol. 312 no. 5770 pp. 90-91, (2006)Google ScholarPubMed
Thienhaus, S., Hamann, S., Ludwig, A.: Modular high-throughput test-stand for versatile screening of thin-film materials libraries. Sci. Technol. Adv. Mater. 2011, 12, No. 054206Google ScholarPubMed
Janghorban, A., Pfetzing-Micklich, J., Frenzel, J., Ludwig, A.: Investigation of the Thin-Film Phase Diagram of the Cr–Ni–Re System by High-Throughput Experimentation, Adv. Eng. Mat., 16, No. 5, (2014)Google Scholar
Spaepen, F.: Interfaces and Stress in thin films, Acta mater. 48, 31, (2000)Google Scholar
Thornton, John A., Hoffman, D.W.: Stress-related effects in thin films, Thin Solid Films, Volume 171, Issue 1, 1 April 1989, Pages 5–31 CrossRefGoogle Scholar
Honig, R.E., Vapor pressure data for solid and liquid elements, RCA Review, 23: 567–586. (1962)Google Scholar
Chapman, B. N.: Thin-film adhesion, Journal of Vacuum Science & Technology 11, 106, (1974)Google Scholar
Pollock, D.D.: Electrical Conduction In Solids: An Introduction, American Society for Metals, Metals-Park, OH (1985)Google Scholar
Thienhaus, S., Naujoks, D., Pfetzing-Micklich, J., König, D., Ludwig, A.: Rapid identification of areas of interest in thin film materials libraries by combining electrical, optical, X-ray diffraction and mechanical high-throughput measurements: a case study for the system Ni-Al, ACS Comb Sci., 16, 686–94, (2014)Google ScholarPubMed