Hostname: page-component-78c5997874-fbnjt Total loading time: 0 Render date: 2024-11-10T08:42:47.117Z Has data issue: false hasContentIssue false
  • English
  • Français

Femtosecond Laser Micromachining of Periodical Structures in Si <100>

Published online by Cambridge University Press:  01 February 2011

Mohamed El-Bandrawy  and
Mool C. Gupta
Mohamed El-Bandrawy
Affiliation:
Applied Research Center, Old Dominion University, Newport News, Virginia, 23606
Mool C. Gupta
Affiliation:
Applied Research Center, Old Dominion University, Newport News, Virginia, 23606
Get access

Abstract

A frequency doubled femtosecond Ti: sapphire laser at a wavelength of 400 nm, a pulse width of 160 fs, and a repetition rate of 1 kHz was used with a computer controlled galvo head to write periodical structures in Si <100>. Laser pulses of ∼130 nJ were focused using an objective lens of 0.65 NA. Laser parameters were optimized for efficient submicron ablation, yielding 700 nm wide by 600 nm deep lines. 1-D and 2-D periodical structures of 5 and 5x5 micron periods, respectively, were fabricated and examined using optical and atomic force microscopy. The quality of the 1-D and 2-D structures was highly depended on the light polarization orientation with respect to micromachining direction. With optimized fs laser parameters, high quality 1-D and 2-D periodical structures were obtained, which would have applications in optical devices.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 850: Symposium MM – Ultrafast Lasers for Materials Science , 2004 , MM1.6
Copyright
Copyright © Materials Research Society 2005

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFRENCES

1- Liu, X., Du, D. and Mourrou, G., “Laser ablation and micromachining with ultrashort laser pulses” IEEE Journal of quantum electronics, 33, 1706–1715 (1997)Google Scholar
2- Kruger, J. and Kautek, W., “The femtosecond pulse laser: a new tool for micromachining” Laser physics, 9, 30–40, (1999).Google Scholar
3- Jianxin, Z., Bernd, H. and Arnd, M., “Micromachining with ultrashort laser pulses” Proceedings of SPIE, 3618, 114–121, (1999).Google Scholar
4- Liu, X. “Ultrafast lasers as a versatile processing tool” Proceedings of SPIE, 3888, 198–209, (2000).Google Scholar
5- Shihoyama, K., Furukawa, A., Bardo, Ph. and Said, A.A., “Micromachining with ultrafast Lasers”, Proceedings of SPIE, 4088, 140–143, (2000).Google Scholar
6- Notle, F., Adams, S., Egbert, A., Fallnich, C. and Ostendrof, A. “Sub-diffraction limited structuring of solid targets with femtosecond laser pulses” Optics express, 7, 41–49, (2000)Google Scholar
7- Dolgaev, S.I., Lavrishev, S.V., Lyalin, A.A., Simakin, A.V., Voronov, V.V. and Shafeev, G.A. “Formation of conical microstructures upon laser evaporation of solids” Appl. Phys. A, 73, 177–181 (2001)Google Scholar
8- Ngoi, B.K.A., Venkatakrishnan, K., Lim, L.E.N. and Tan, B., “Submicron micromachining on silicon wafer using femtosecond pulse laser” Journal of Laser applications, 13, 41–43, (2001).Google Scholar
9- Ngoi, B.K.A., Venkatakrishnan, K., Lim, L.E.N. and Tan, B., “Effect of energy above laser-induced damage thresholds in the micromachining of silicon by femtosecond pulse laser” Optics and Laser in Engineering, 35, 361–69, (2001).Google Scholar