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Fracture Tests Of Polysilicon Film

Published online by Cambridge University Press:  10 February 2011

W. N. Sharpe Jr. ,
B. Yuan  and
R. L. Edwards
W. N. Sharpe Jr.
Affiliation:
ME Department, Johns Hopkins University, Baltimore, MD 21218, sharpe@jhu.edu
B. Yuan
Affiliation:
ME Department, Johns Hopkins University, Baltimore, MD 21218, sharpe@jhu.edu
R. L. Edwards
Affiliation:
Applied Physics Laboratory, Johns Hopkins University, Laurel, MD 20723
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Abstract

A new test approach is presented to measure the fracture toughness of thin films. The polysilicon specimen is a center-cracked panel that is 3.5 μm thick and 3 mm wide with a 100 μm long slot in the center. It is subjected to tensile loading, and the crack-opening displacement is measured by interferometry. The average toughness is 1.4 ± 0.65 MPa-m1/2.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 505 , 1997 , 51
Copyright
Copyright © Materials Research Society 1998

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References

REFERENCES

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