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Growth and Characterization of Uniform Carbon Nanotube Arrays on Active Substrates

Published online by Cambridge University Press:  17 March 2015

Qiuhong Zhang ,
Betty T. Quinton ,
Bang-Hung Tsao ,
James Scofield ,
Neil Merrett ,
Jacob Lawson ,
Kevin Yost  and
Levi Elston
Qiuhong Zhang
Affiliation:
University of Dayton Research Institute, 300 College Park, Dayton, OH 45469, USA
Betty T. Quinton
Affiliation:
Air Force Research Laboratory, Wright Patterson AFB, OH 45433, USA
Bang-Hung Tsao
Affiliation:
University of Dayton Research Institute, 300 College Park, Dayton, OH 45469, USA
James Scofield
Affiliation:
Air Force Research Laboratory, Wright Patterson AFB, OH 45433, USA
Neil Merrett
Affiliation:
Air Force Research Laboratory, Wright Patterson AFB, OH 45433, USA
Jacob Lawson
Affiliation:
University of Dayton Research Institute, 300 College Park, Dayton, OH 45469, USA
Kevin Yost
Affiliation:
Air Force Research Laboratory, Wright Patterson AFB, OH 45433, USA
Levi Elston
Affiliation:
Air Force Research Laboratory, Wright Patterson AFB, OH 45433, USA
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Abstract

Carbon nanotubes (CNTs) have unique thermal/electrical/mechanical properties and high aspect ratios. Growth of CNTs directly onto reactive material substrates (such as metals and carbon based foam structures, etc.) to create a micro-carbon composite layer on the surface has many advantages: possible elimination of processing steps and resistive junctions, provision of a thermally conductive transition layer between materials of varying thermal expansion coefficients, etc. Compared to growing CNTs on conventional inert substrates such as SiO2, direct growth of CNTs onto reactive substrates is significantly more challenging. Namely, control of CNT growth, structure, and morphology has proven difficult due to the diffusion of metallic catalysts into the substrate during CNT synthesis conditions. In this study, using a chemical vapor deposition method, uniform CNT layers were successfully grown on copper foil and carbon foam substrates that were pre-coated with an appropriate buffer layer such as Al2O3 or Al. SEM images indicated that growth conditions and, most notably, substrate surface pre-treatment all influence CNT growth and layer structure/morphology. The SEM images and pull-off testing results revealed that relatively strong bonding existed between the CNT layer and substrate material, and that normal interfacial adhesion (0.2‒0.5 MPa) was affected by the buffer layer thickness. Additionally, the thermal properties of the CNT/substrate structure were evaluated using a laser flash technique, which showed that the CNT layer can reduce thermal resistance when used as a thermal interface material between bonded layers.

Keywords

chemical vapor deposition (CVD) (deposition)Cufoam
Type
Articles
Information
MRS Online Proceedings Library (OPL) , Volume 1752: Symposium MM – Carbon Nanotubes—Synthesis, Properties, Functionalization, and Applications , 2014 , pp. 3 - 14
Copyright
Copyright © Materials Research Society 2015 

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References

REFERENCES

Teresa de los Arcos, Garnier, M.G., Carbon (42), 187–190, 2004.Google Scholar
Handuja, S., Srivastava, P., and Vankar, V.D., Nanoscale Res Lett (5), 1211–1216, 2010.10.1007/s11671-010-9628-8CrossRefGoogle Scholar
Cao, A., Ajayan, P.M., Ramanath, G., Applied Physics Letters (84), 109–111, 2004.CrossRefGoogle Scholar
Lin, W., Olivares, V.R., Liang, Q.Z.., Zhang, R.W., “9th IEEE Conference on Nanotechnology, 2009.Google Scholar
Lin, W., Moon, K. S., Wong, C.P., Advanced Materials (21), 2421–2424, 2009.CrossRefGoogle Scholar
Mukhopadhyay, S. M., Karumuri, A., Barney, I., J. Phys. D(42), 19, 2009.CrossRefGoogle Scholar
Xu, J. and Fisher, T. S., International Journal of Heat and Mass Transfer (49), 1658–1666, 2006.10.1016/j.ijheatmasstransfer.2005.09.039CrossRefGoogle Scholar
Tong, T., Zhao, Y., Delzeit, L., Kashani, A., Meyyappan, M., and Majumdar, A., IEEE Transactions on Components and Packaging Technologies (30), 92–100, 2007.CrossRefGoogle Scholar
Kordas, K., Toth, G., Moilanen, P., Kumpumaki, M., Vahakangas, J., Uusimaki, A., Vajtai, R., and Ajayon, P. M., Applied Physics Letters (90), 123105, 2007.CrossRefGoogle Scholar
Cola, B.A., Xu, J., Cheng, C.R., Xu, X.F., Fisher, T.S., and Hu, H.P., Journal of Applied Physics (101), 054313, 2007.CrossRefGoogle Scholar
Huang, H., Liu, C.H., Wu, Y., and Fan, S.S., Advanced Materials (17), 1652–1653, 2005.CrossRefGoogle Scholar
Panzer, M.A., Zhang, G., Mann, D., Hu, X., Pop, E., Dai, H., and Goodson, K.E., Journal of Heat Transfer-Transactions of the ASME (130), 052401, 2008.CrossRefGoogle Scholar
Sihn, S., Ganguli, S., Roy, A.K., Qu, L.T., and Dai, L.M., Composites Science and Technology (68), 658–665, 2008.CrossRefGoogle Scholar
Liu, H., Zhang, Y., Arato, D., Li, R., Merel, P., Surface & coating Technology (202), 4114–4120, 2008.CrossRefGoogle Scholar
Gan, B., Ahn, J., Zhang, Q., Yoon, S.F., Yu, J., Chem. Phys. Lett. (333), 23–28, 2001.CrossRefGoogle Scholar
Qin, Y., Zhang, Q., Cui, Z.L., J. Catal. (223), 389–394, 2004.CrossRefGoogle Scholar
Zhang, Z., He, P., Sun, Z., Feng, T., Chen, Y., Li, H., and Tay, B., Applied Surface Science (256), 4417–4422, 2010.CrossRefGoogle Scholar
Zhao, N., Kang, J., Carbon Nanotubes-Synthesis, Characterization, Applications (6), 99–116, 2011.Google Scholar
Wang, Y., Li, B., Ho, P. S., Yao, Z., Shi, L., Applied Physics Letters (89), 1831131–1831133, 2006.Google Scholar
Zhang, Q., Liu, J., Sager, R., Dai, L., and Baur, J., Composites Science and Technology (69), 594–601, 2009.CrossRefGoogle Scholar
Fan, Y., Yang, H., Zhu, H., Liu, X., Li, M., Qu, Y., Yang, N., and Zou, G., Metallurgical and Materials Transactions A (38), 2148, 2007.Google Scholar
Konya, Z., Vilarinho, P.M., Mahajan, A., and Kingon, A., Materials Letters (90), 165–168, 2013.Google Scholar