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Published online by Cambridge University Press: 21 February 2011
Using methyltrichlorosilane diluted with hydrogen and a modified temperature program during the initial stage of the deposition we have improved the deposition process and obtained high quality heteroepitaxial films on Si (100) without any carbon buffer layer. The maximum temperature of 1200°C which is used for the substrate cleaning and film deposition is significantly lower than that used in the conventional deposition system SiH4/C3H8 of about 1400°C for the buffer layer and 1350°C for deposition.