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High Resolution Thermal Imaging of Integrated Circuits

Published online by Cambridge University Press:  01 February 2011

Gilles Tessier ,
Mathieu Bardoux ,
Céline Filloy  and
Danièle Fournier
Gilles Tessier
Affiliation:
tessier@optique.espci.fr, ESPCI, Laboratoire d'optique, 10 Rue Vauquelin, Paris, 75005, France, 33 1 40 79 45 39, 33 1 43 36 23 95
Mathieu Bardoux
Affiliation:
mathieu.bardoux@espci.fr, ESPCI / UPRA005 CNRS, Laboratoire d'optique, 10 Rue Vauquelin, Paris, 75005, France
Céline Filloy
Affiliation:
filloy@optique.espci.fr, ESPCI / UPRA005 CNRS, Laboratoire d'optique, 10 Rue Vauquelin, Paris, 75005, France
Danièle Fournier
Affiliation:
fournier@optique.espci.fr, ESPCI / UPRA005 CNRS, Laboratoire d'optique, 10 Rue Vauquelin, Paris, 75005, France
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Abstract

Thermoreflectance is an non contact optical method using the local reflectivity variations induced by heating to infer temperature mappings, and can be conducted at virtually any wavelength. In the visible, the technique is now well established. It can probe temperatures through several micrometers of transparent encapsulation layers, with sub-micron spatial resolution and 100 mK thermal resolution. In the ultraviolet range, dielectric encapsulation layers are opaque and thermoreflectance gives access to the surface temperature. In the near infrared, thermoreflectance is an interesting solution to examine chips turned upside down, since these wavelengths can penetrate through silicon substrates and give access to the temperature of the active layers themselves. Here, we explore the possibilities of each wavelength range and detail the CCD-based thermal imaging tools dedicated to the high resolution inspection of integrated circuits.

Keywords

photoreflectanceoptical propertiessemiconducting
Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 1022: Symposium II – Nanoscale Heat Transport–From Fundamentals to Devices , 2007 , 1022-II06-02
Copyright
Copyright © Materials Research Society 2007

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