Hostname: page-component-78c5997874-fbnjt Total loading time: 0 Render date: 2024-11-13T02:06:50.549Z Has data issue: false hasContentIssue false
  • English
  • Français

High Temperature Alternating Copolymers As Dielectric Materials: Synthesis, Structure And Properties

Published online by Cambridge University Press:  15 February 2011

M. Ree ,
W.H. Goh ,
J.-W. Park ,
M.-H. Lee  and
S.B. Rhee
M. Ree
Affiliation:
Dept. of Chemistry, Pohang University of Science & Technology, San 31 Hyoja-dong, Pohang, Kyongbuk 790-784 South Korea
W.H. Goh
Affiliation:
Dept. of Chemistry, Pohang University of Science & Technology, San 31 Hyoja-dong, Pohang, Kyongbuk 790-784 South Korea
J.-W. Park
Affiliation:
Polymer Research Division, Korea Research Institute of Chemical Technology, P.O.Box 9, Daedeog-danji, Taejon 305-606 South Korea
M.-H. Lee
Affiliation:
Polymer Research Division, Korea Research Institute of Chemical Technology, P.O.Box 9, Daedeog-danji, Taejon 305-606 South Korea
S.B. Rhee
Affiliation:
Polymer Research Division, Korea Research Institute of Chemical Technology, P.O.Box 9, Daedeog-danji, Taejon 305-606 South Korea
Get access

Abstract

A new diamine monomer, N,N'-bis(4-aminophenyl)-2,5-(diisopropoxycarbony)benzene-l,4-dicarboxamide was synthesized. Using the diamine, several alternating copolyimide precursors were successfully synthesized by its condensation polymerization with dianhydrides. The structure and properties (mechanical properties and thermal expansivity) of alternating copolyimides imidized thermally were characterized, and compared with those of the corresponding randomcopolyimides prepared from the copoly(amic acid)s. The alternating copolyimides exhibited relatively higher chain order and in-plane orientation in films than the random copolyimides. The higher chain order and in-plane orientation led to the higher tensile modulus and lower thermal expansivity in the alternating copolyimides. Such effect of comonomer sequence was found to be highly pronounced in copolyimides consisting of comonomers which have a large difference in the chain rigidity. It was demonstrated in this study that the formation of alternating copolyimides is a suitable route to improve the performance of properties.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 381: Symposium F – Low-Dielectric Constant Materials--Synthesis and Applications in Micro. , 1995 , 71
Copyright
Copyright © Materials Research Society 1995

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1. Sroog, CE (1991) Prog Polym Sci 16: 561 Google Scholar
2. Feger, C, Khojasteh, MM, Htoo, MS (eds) (1993) Advances in Polyimide Science and Technology. Technomic, Lancaster PA Google Scholar
3. Tummala, RR, Rymaszewski, EJ (eds) (1989) Microelectronics Packaging Handbook. van Nostrand Reinhold, New York Google Scholar
4. Czomyj, G, Chen, KJ, Prada-Silva, G, Arnold, A, Souleotis, HA, Kim, S, Ree, M, Volksen, W, Dawson, D, DiPietro, R (1992) Proc Elect Comp Tech (IEEE) 42: 682 Google Scholar
5. Ree, M, Chu, WU, Goldberg, MJ(1994) J Appl Phys 75: 1410 Google Scholar
6. Hoffman, WR (1966) In: Hass, G, Thun, RE (eds) Physics of Thin Film. Academic, New York (vol 3, pp 211)Google Scholar
7. Sylvester, MF, Olenick, JA (1991) Proc Int Elect Packaging Conf (pp 833)Google Scholar
8. Brandrup, J, Immergut, EH (eds) Polymer Handbook (2nd ed). Wiley, New York Google Scholar
9. Rhee, SB, Park, JW, Moon, BS, Chang, JY (1993) Macromolecules 26: 404 Google Scholar
10. Yoon, DY, Volksen, W, Depero, L, Parrish, W, Ree, M (1991) MRS Symp Proc 227: 371 Google Scholar