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Hydrodynamics of a Chemical-Mechanical Planarization Process

Published online by Cambridge University Press:  10 February 2011

In-Sung Sohn ,
Brij Moudgil ,
Rajiv Singh  and
C.-W. Park
In-Sung Sohn
Affiliation:
Department of Chemical Engineering, University of Florida, Gainesville, FL 32611
Brij Moudgil
Affiliation:
Department of Material Science and Engineering, University of Florida, Gainesville, FL 32611
Rajiv Singh
Affiliation:
Department of Material Science and Engineering, University of Florida, Gainesville, FL 32611
C.-W. Park
Affiliation:
Department of Chemical Engineering, University of Florida, Gainesville, FL 32611
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Abstract

The flow of a slurry in a CMP process has been investigated. This wafer-scale model provides the three dimensional flow field of the slurry, the spatial distribution of the local shear rate imposed on the wafer surface, and the streamline patterns which reflect the transport characteristics of the slurry.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 566: Symposium P – Chemical-Mechanical Poilshing-Fundamentals and Challenges , 1999 , 181
Copyright
Copyright © Materials Research Society 2000

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References

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