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Investigation of Specimen- and Grain-Size Dependence of Yield Stress in Electrodeposited Nanocrystalline Copper through Micropillar Compression

Published online by Cambridge University Press:  29 April 2013

Norihiko L. Okamoto ,
Daisuke Kashioka  and
Haruyuki Inui
Norihiko L. Okamoto
Affiliation:
Department of Materials Science and Engineering, Kyoto University, Sakyo-ku, Kyoto 606-8501, Japan
Daisuke Kashioka
Affiliation:
Department of Materials Science and Engineering, Kyoto University, Sakyo-ku, Kyoto 606-8501, Japan
Haruyuki Inui
Affiliation:
Department of Materials Science and Engineering, Kyoto University, Sakyo-ku, Kyoto 606-8501, Japan
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Abstract

The specimen-size dependence of yield stress of nanocrystalline copper with average grain size (d) of 360 nm has been investigated through uniaxial compression tests of micrometer-size pillars fabricated via the focused ion beam method. The yield stress decreases with the decrease in the micropillar size while the yield stress is almost constant for larger micropillars. The critical specimen size (t) is approximately 12.5 μm, correspoinding to the critical (t/d) value, (t/d)*, of 35, which is much larger than that for coarse-grained copper polycrystals.

Keywords

Cuelectrodepositionnanostructure
Type
Articles
Information
MRS Online Proceedings Library (OPL) , Volume 1513: Symposium GG – Mechanical Behavior of Metallic Nanostructured Materials , 2013 , mrsf12-1513-gg06-05
Copyright
Copyright © Materials Research Society 2013

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References

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