No CrossRef data available.
Article contents
Ion Beam Etching System for Mercury Cadmium Telluride and III-V Compound Semiconductors
Published online by Cambridge University Press: 25 February 2011
Abstract
This paper describes a laboratory built ion beam etching system and its performance when used for etching Hg1-xCdxTe, GaAs and InP. The etching system provides a means for forming device mesas on a wide range of semiconductors without having to resort to wet chemical etches. The system uses a Kaufmann ion source, a rotating platform and two flow controllers to allow the variation of gas ratios and flows.
- Type
- Research Article
- Information
- Copyright
- Copyright © Materials Research Society 1992
References
1.
Leech, P.W., Reeves, G.K. and Kibel, M. H., Proceedings of Mat. Res. Soc. Symp., Vol. 216, 1991. pp. 155–160.CrossRefGoogle Scholar
2.
Leech, P.W., Kibel, M. H. and Gwynn, P.J., J. Electrochem. Soc., Vol. 137, No. 2, 1990. pp. 705–707.CrossRefGoogle Scholar
3.
Dry etching for Microelectronics, edited by Powell, R. (North-Holland, New York, 1984).Google Scholar
4.
Vaseashta, A.
et al. , IEEE Trans. on Compon. Hybrids and Manufac., Vol. 13, No. 4, 1990. pp. 617–622.Google Scholar
5.
Bouadma, N., Hogrel, J.F., Charil, J. and Carre, M., IEEE J. Quantum Electron., Vol. QE–23, No.6, 1987. pp. 909–914.CrossRefGoogle Scholar
6.
Semu, A., Montelius, L., Leech, P., Jamieson, D. and Silverberg, P., Appl. Phys. Letts., Vol. 59, 1991. pp. 1752.CrossRefGoogle Scholar