Hostname: page-component-cd9895bd7-dk4vv Total loading time: 0 Render date: 2024-12-28T22:01:32.178Z Has data issue: false hasContentIssue false

ITO-Channel Ferroelectric-Gate Thin Film Transistor with Large On/off Current Ratio

Published online by Cambridge University Press:  01 February 2011

Eisuke Tokumitsu
Affiliation:
tokumitu@neuro.pi.titech.ac.jp, Tokyo Institute of Technology, Precision and Intelligence Laboratory, 4259-R2-19, Nagatsuta, Midori-ku, Yokohama, 226-8503, Japan
Masaru Senoo
Affiliation:
senoo@neuro.pi.titech.ac.jp, Tokyo Institute of Technology, Yokohama, 226-8503, Japan
Etsu Shin
Affiliation:
shin@neuro.pi.titech.ac.jp, Tokyo Institute of Technology, Yokohama, 226-8503, Japan
Tomofumi Fujimura
Affiliation:
fujimura@neuro.pi.titech.ac.jp, Tokyo Institute of Technology, Yokohama, 226-8503, Japan
Get access

Abstract

Indium tin oxide (ITO)-channel ferroelectric-gate thin film transistor (TFT) with large on/off current ratio is demonstrated by using mechanical polishing process to planarize the surface of ferroelectric bottom gate insulator (Bi,La)4Ti3O12 (BLT). It is shown that the mechanical polishing of the sol-gel derived polycrystalline ferroelectric BLT films causes no degradation in electrical properties. ITO channel layer was then deposited on the planarized BLT gate insulator to fabricate ferroelectric-gate TFTs. The off-current of the ITO/BLT TFT fabricated with the polishing process is drastically reduced to around 10−12 A, which is four orders of magnitude lower than that of the TFT fabricated without the polishing process. The obtained on/off current ratio is more than 107. In addition, a subthreshold voltage swing as small as 200 mV/decade was obtained.

Type
Research Article
Copyright
Copyright © Materials Research Society 2007

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1. Scott, J. F., Araujo, C.A. Paz de, Science 246, 1400 (1989).Google Scholar
2. Araujo, C.A. Paz de, Cuchiaro, J.D., McMillan, L.D., Scott, M. C., Scott, J. F., Nature 374, 627, (1995).Google Scholar
3. Tokumitsu, E., Fujii, G. and Ishiwara, H., Appl. Phys. Lett. 75, 575 (1999).Google Scholar
4. Tokumitsu, E., Okamoto, K. and Ishiwara, H., Jpn. J. Appl. Phys. 40, 2917 (2001).Google Scholar
5. Senoo, M., Miyasako, T. and Tokumitsu, E., International Workshop on Dielectric Thin Films for Future ULSI Devices (IWDTF 2004), Tokyo, pp.5758, (2004).Google Scholar
6. Tokumtisu, E. and Senoo, M., 2004 Materials Research Society Fall Meeting, paper D2.6, Nov.29-Dec.3, Boston, 2004.Google Scholar
7. Miyasako, T., Senoo, M. and Tokumitsu, E., Appl. Phys. Lett., 86, 162902 (2005).Google Scholar
8. Tokumitsu, E., Senoo, M. and Miyasako, T., J. Microelectronic Engineering, 80, 305 (2005).Google Scholar