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Lateral Grain Growth in the Excimer Laser Crystallization ofPoly-Si
Published online by Cambridge University Press: 15 February 2011
Abstract
We have succeeded in obtaining nondoped, thin poly-Si film (thickness ∼500Å)with excellent crystallinity and large grain size (Maximum grain size ∼4.5 μm) by an excimer laser annealing Method, which offers the features oflow-temperature processing and a short processing time. The grain sizedistribution shrinks in the region around 1.5 μ m and this poly-Si filmexhibits a strong (111) crystallographic orientation. Poly-Si thin filmtransistors using these films show quite a high field effect mobility of 440cm2/V · s below 600°C process.
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- Copyright © Materials Research Society 1994
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