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Low Profile Packaging for MEMS Aero-acoustic Sensors

Published online by Cambridge University Press:  12 January 2012

John R. Burns ,
Robert D. White  and
Joshua S. Krause
John R. Burns
Affiliation:
Department of Mechanical Engineering, Tufts University, 200 College Ave., Medford, MA 02155
Robert D. White
Affiliation:
Department of Mechanical Engineering, Tufts University, 200 College Ave., Medford, MA 02155
Joshua S. Krause
Affiliation:
Department of Mechanical Engineering, Tufts University, 200 College Ave., Medford, MA 02155
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Abstract

This paper describes a semi-automated conductive ink process used for packaging MEMS devices. The method is applied to packaging of MEMS sensors for wind tunnel testing. The primary advantage of the method is a reduction in surface topology between the package and the integrated MEMS sensors. In this paper we explore the relationship between trace dimensions, resistivity, and deposition parameters such as feed rate, tip-substrate separation and tip diameter. Using this procedure it is possible to generate interconnects between a PC board and MEMS sensor chip with a topology of less than 25 micrometers.

Keywords

acousticpackagingsensor
Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 1415: Symposium HH/II/TT – MEMS, BioMEMS and Bioelectronics–Materials and Devices , 2012 , mrsf11-1415-tt01-03
Copyright
Copyright © Materials Research Society 2012

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References

REFERENCES

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