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Low Temperature Plasma Sintering of Silver Nanoparticles for Potential Flexible Electronics Applications

Published online by Cambridge University Press:  07 January 2013

Siyuan Ma ,
Vadim Bromberg ,
Frank D. Egitto  and
Timothy J. Singler
Siyuan Ma
Affiliation:
Mechanical Engineering Department, Binghamton University, Binghamton, NY 13905, U.S.A.
Vadim Bromberg
Affiliation:
Mechanical Engineering Department, Binghamton University, Binghamton, NY 13905, U.S.A.
Frank D. Egitto
Affiliation:
Research and Development, Endicott Interconnect Technologies, Endicott, NY 13760, U.S.A.
Timothy J. Singler
Affiliation:
Mechanical Engineering Department, Binghamton University, Binghamton, NY 13905, U.S.A.
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Abstract

Deposition of solution-processed functional materials generally requires additional post-processing to optimize the functionality of the material. We study sintering of Ag nanoparticle (NP) (with average diameter 77nm) deposits for improved electrical conductivity, with emphasis on Argon plasma methods compatible with the low temperature requirements of regular low-cost flexible polymer substrates. The relationship between plasma parameters (such as power and treatment time) versus sintering results (sintered structure depth, film continuity and electrical sheet resistance) will be reported. According to our efforts so far, we have achieved the electrical resistivity of the sintered film at about 20 times greater than the value of bulk silver using a process compatible with the low temperature requirements of common flexible polymer substrates.

Keywords

sinteringAgnanostructure
Type
Articles
Information
MRS Online Proceedings Library (OPL) , Volume 1529: Symposium WW – Roll-to-Roll Processing of Electronics and Advanced Functionalities , 2012 , mrsf12-1529-ww06-14
Copyright
Copyright © Materials Research Society 2012

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References

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