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Low-Temperature Photosensitive Polyimide Processing for Use in 3D Integration Technologies

Published online by Cambridge University Press:  03 June 2014

Frank Windrich ,
Mikhail Malanin ,
Klaus J. Eichhorn ,
Brigitte Voit  and
Klaus D. Lang
Frank Windrich
Affiliation:
Center “All Silicon System Integration Dresden”, Fraunhofer IZM, Moritzburg, Germany Organic Chemistry of Polymers, Technische Universität Dresden, Dresden, Germany
Mikhail Malanin
Affiliation:
Leibniz-Institut für Polymerforschung Dresden e.V., Dresden, Germany
Klaus J. Eichhorn
Affiliation:
Leibniz-Institut für Polymerforschung Dresden e.V., Dresden, Germany
Brigitte Voit
Affiliation:
Leibniz-Institut für Polymerforschung Dresden e.V., Dresden, Germany Organic Chemistry of Polymers, Technische Universität Dresden, Dresden, Germany
Klaus D. Lang
Affiliation:
Center “All Silicon System Integration Dresden”, Fraunhofer IZM, Moritzburg, Germany
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Keywords

polymerkineticsmicroelectronics
Type
Articles
Information
MRS Online Proceedings Library (OPL) , Volume 1692: Symposium CC – New Materials and Processes for Interconnects, Novel Memory and Advanced Display Technologies , 2014 , mrss14-1692-cc06-02
Copyright
Copyright © Materials Research Society 2014 

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References

REFERENCES

Woehrmann, M. and Toepper, M., “Polymerization of Thin Film Polymers”, New Polymers for Special Applications, ed. Ailton De Souza Gomes, Dr., ISBN: 978-953-51-0744-6, (InTech 2012), pp. 113–138, DOI: 10.5772/48205 Google Scholar
Matsutani, H., Hattori, T., Ohe, M., Ueno, T., Hubbard, R. L., Fathi, Z., “ Low temperature curing of polyimide precursors by variable frequency microwave ”, Journal Photopolymer Science and Technology, 18, pp. 327–332, (2005)CrossRefGoogle Scholar
Kreuz, J. A.. Endrey, A. L., Gay, F. P., Sroog, C. E., “ Studies of thermal cyclizations of polyamic acids and tertiary amine salts ”, Journal of Polymer Science Part A-1: Polymer Chemistry, 4, pp. 2607–2616, (1966)Google Scholar
Seo, Y., Lee, S. M., Kim, D. Y., Kim, K. U., “ Kinetic study of the imidization of a Poly(ester amic acid) by FT-Raman spectroscopy ”, Macromolecules, 30, pp. 3747–3753, (1997)CrossRefGoogle Scholar
Windrich, F., Malanin, M., Eichhorn, K.-J. and Voit, B. “ Modeling the imidization kinetics of a low temperature cure photosensitive polyimide in solid state ”, Proceedings 10th International Wafer-Level Packaging Conference - IWLPC, (2013)Google Scholar
Russell, J. D., Kardos, J. L., “ Modeling the imidization kinetics of AFR700B polyimide ”, Polymer Composites, 18, pp. 64–78, (1997)CrossRefGoogle Scholar