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Material Development Challenges in High Density Pakaging of Advanced VLSI Memory Devices

Published online by Cambridge University Press:  21 February 2011

Steven D. Prough  and
D. Elaine Pope
Steven D. Prough
Affiliation:
Intel Corporation, 145 S. 79th St., Chandler, AZ 85226
D. Elaine Pope
Affiliation:
Intel Corporation, 145 S. 79th St., Chandler, AZ 85226
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Abstract

Advances in semiconductor memory storage technology are making possible the development of high density memory cards for hand held and portable product applications. This in turn is driving development of ever denser, ultra-thin component packages. Both materials and package design must be more robust in order for next generation packages to withstand surface mount reflow soldering stresses. Trade-offs among ercapsulant properties may be possible in view of new interconnect, die surface protection and leadframe design technologies which are being adopted for high density packaging. Materials and packaging engineers are challenged to capitalize on opportunities offered by these changes in order to optimize strength and moisture resistarnce in developing encapsulating materials for the new generation of packages.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 167: Symposium K – Advanced Electronic Packaging Materials , 1989 , 5
Copyright
Copyright © Materials Research Society 1990

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