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Mechanical Characterization of Interfacial Adhesion in Elastomeric Material for Microelectronic Device through JKR Model Combined with Micro-to-Nano IIT

Published online by Cambridge University Press:  31 January 2011

Gyujei Lee
Affiliation:
jerome.lee@hynix.comjerome72@snu.ac.kr, Hynix Semiconductor Inc., R&D, PKG Development, San136-1, Ami-ri, Bubal-eub, Icheon-si, Gyeonggi-do, Icheon, 467-701, Korea, Republic of
Jae-sung Oh
Affiliation:
Jaesung.oh@hynix.com, Hynix Semiconductor Inc., R&D, Icheon, Korea, Republic of
Kwang-yoo Byun
Affiliation:
Kwangyoo.byun@hynix.com, Hynix Semiconductor Inc., R&D, Icheon, Korea, Republic of
Seung-kyun Kang
Affiliation:
skkang@snu.ac.kr, Seoul National University, Materials Science & Engineering, Seoul, Korea, Republic of
Dongil Kwon
Affiliation:
dongilk@snu.ac.kr, Seoul National University, Materials Science & Engineering, Seoul, Korea, Republic of
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Abstract

Instrumented indentation testing (IIT) is a very useful technology for the mechanical characterization of materials. However, existing IIT techniques, which are based on the Hertz model and were developed for hard materials with negligible surface adhesion such as metals and ceramics, are difficult to directly apply to compliant materials such as elastomeric polymers which have viscoelastic hysteresis due to infinitesimal surface/interfacial adhesion. Here we employed some modified model to evaluate the work of adhesion in elastomeric polymer from our previous work, and reinforced our theory and algorithm through empirical approaches so as to consider the time-dependency of viscoelastic material as testing parameter. To do these all, we combined analytic JKR theory and conventional IIT technology to analyze the physical meaning of the theory and then verified our ideas experimentally with elastomeric polymer, PDMS (poly(dimethyl-siloxane)), of various compositions. Our algorithm was developed and verified on a microinstrumented indentation basis and extended even into the nanoinstrumented testing for the micro/nano-scaled applications.

Type
Research Article
Copyright
Copyright © Materials Research Society 2009

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