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Mechanical Properties and Fracture Behavior of the Cu and Cu6Sn5–Dispersed Sn-Pb Solder Bumps Processed by Screen Printing

Published online by Cambridge University Press:  21 March 2011

Ho-Seob Cha ,
Kwang-Eung Lee ,
Jin-Won Choi  and
Tae-Sung Oh
Ho-Seob Cha
Affiliation:
Department of Metallurgical Engineering and Materials Science, Hong Ik University, Seoul 121-791, Korea
Kwang-Eung Lee
Affiliation:
Department of Metallurgical Engineering and Materials Science, Hong Ik University, Seoul 121-791, Korea
Jin-Won Choi
Affiliation:
Department of Metallurgical Engineering and Materials Science, Hong Ik University, Seoul 121-791, Korea
Tae-Sung Oh
Affiliation:
Department of Metallurgical Engineering and Materials Science, Hong Ik University, Seoul 121-791, Korea
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Abstract

The mechanical properties of the 1-9 vol % Cu and Cu6Sn5-dispersed 63Sn-37Pb solder alloys were characterized with tensile test. Also, the Cu and Cu6Sn5-dispersed 63Sn-37Pb solder bumps of 760 μm size were fabricated on the Au(5 μm)/Ni(5 μm)/Cu(27 μm) BGA substrates by screen printing process, and their shear strength were characterized with variations of the dwell time at the reflow peak temperature(220°C) and aging time at 150°C. The yield strength and ultimate tensile strength of the 63Sn-37Pb solder alloy increased with dispersion of 1-9 vol % Cu and Cu6Sn5. In general, however, the Cu and Cu6Sn5-dispersed solder bumps exhibited lower shear strengths than those of the 63Sn-37Pb solder bumps The failure surface of the solder bumps after ball shear test could be divided into two regions of slow crack propagation and critical crack propagation, and the shear strength of solder bumps was inversely proportional to the slow crack propagation length.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 682: Symposium N – Microelectronics and Microsystems Packaging , 2001 , N3.4
Copyright
Copyright © Materials Research Society 2001

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References

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