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Mechanism of a New Post CMP Cleaning for Trench Isolation Process

Published online by Cambridge University Press:  10 February 2011

N. Miyashita ,
Y. Mase ,
J. Takayasu ,
Y. Minami ,
M. Kodera ,
M. Abe  and
T. Izumi
N. Miyashita
Affiliation:
Microelectronics Center, Toshiba Corporation 8, Shinsugita-cho, Isogo-ku, Yokohama 235–8522, Kanagawa Japan
Y. Mase
Affiliation:
Microelectronics Center, Toshiba Corporation 8, Shinsugita-cho, Isogo-ku, Yokohama 235–8522, Kanagawa Japan
J. Takayasu
Affiliation:
Microelectronics Center, Toshiba Corporation 8, Shinsugita-cho, Isogo-ku, Yokohama 235–8522, Kanagawa Japan
Y. Minami
Affiliation:
Microelectronics Center, Toshiba Corporation 8, Shinsugita-cho, Isogo-ku, Yokohama 235–8522, Kanagawa Japan
M. Kodera
Affiliation:
Microelectronics Center, Toshiba Corporation 8, Shinsugita-cho, Isogo-ku, Yokohama 235–8522, Kanagawa Japan
M. Abe
Affiliation:
Microelectronics Center, Toshiba Corporation 8, Shinsugita-cho, Isogo-ku, Yokohama 235–8522, Kanagawa Japan
T. Izumi
Affiliation:
Department of electronics, Tokai Univ. 1117 kitakaname, hiratsuka, Kanagawa, JAPAN
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Abstract

CMP has been revealed as an attractive technique to poly Si of trench planalizing process. Major issues of process integration for that purpose have been post-CMP cleaning process. A new post CMP cleaning process which employed special organic surfactant has been reported in this paper. In general, wafers after CMP process are contaminated by particles and metallic impurities in the case of conventional cleaning method. The contamination introduce the defects into the wafers after oxidation. The contamination was removed by new cleaning method. using DI water containing special organic surfactant and silica particles. The experimental work has focused on critical problems that had to be solved, using AFM, EDX and VPDICP/MS.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 566: Symposium P – Chemical-Mechanical Poilshing-Fundamentals and Challenges , 1999 , 253
Copyright
Copyright © Materials Research Society 2000

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References

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