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Metal Containing Link Formed in Amorphous Silicon Metal-To-Metal Antifuse

Published online by Cambridge University Press:  01 February 2011

Frank Hawley ,
Farid Issaq ,
Jeewika Ranaweera  and
Roy Lambertson
Frank Hawley
Affiliation:
John McCollum Actel Corp., 955 E. Arques Ave., Sunnyvale, Ca. 94086, USA
Farid Issaq
Affiliation:
John McCollum Actel Corp., 955 E. Arques Ave., Sunnyvale, Ca. 94086, USA
Jeewika Ranaweera
Affiliation:
John McCollum Actel Corp., 955 E. Arques Ave., Sunnyvale, Ca. 94086, USA
Roy Lambertson
Affiliation:
John McCollum Actel Corp., 955 E. Arques Ave., Sunnyvale, Ca. 94086, USA
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Abstract

A Metal-to-Metal (M2M) antifuse is formed using hydrogenated amorphous silicon as a dielectric material between two refractory metal electrodes. The M2M antifuse is used as a programmable device in an FPGA, where it is placed between two interconnect metal layers of a Logic CMOS process. The M2M device may then be programmed to interconnect logic circuits. The resulting programmed link is an alloy of amorphous silicon and barrier metal that forms a low resistance path between the logic circuits.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 762: Symposium A – Amorphous and Nanocrystalline Silicon-Based Films – 2003 , 2003 , A16.7
Copyright
Copyright © Materials Research Society 2003

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References

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