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Micromachined Lateral Force Sensors for Characterization of Microscale Surface Forces During Chemical Mechanical Polishing

Published online by Cambridge University Press:  01 February 2011

Douglas Gauthier ,
Andrew Mueller ,
Robert David White ,
Vincent Manno ,
Chris Rogers ,
Donald Hooper ,
Sriram Anjur  and
Mansour Moinpour
Douglas Gauthier
Affiliation:
douglas.gauthier@tufts.edu, Tufts University, Medford, MA, 02155, United States
Andrew Mueller
Affiliation:
amueller@draper.com, Tufts University, Medford, MA, 02155, United States
Robert David White
Affiliation:
r.white@tufts.edu, Tufts University, Mechanical Engineering, 200 College Ave, Medford, MA, 02155, United States
Vincent Manno
Affiliation:
vincent.manno@tufts.edu, Tufts University, Medford, MA, 02155, United States
Chris Rogers
Affiliation:
crogers@tufts.edu, Tufts University, Medford, MA, 02155, United States
Donald Hooper
Affiliation:
don.fab11.hooper@intel.com, Intel Corporation, Santa Clara, CA, 95052, United States
Sriram Anjur
Affiliation:
Sriram_Anjur@cabotcmp.com, Cabot Microelectronics, Aurora, IL, 60504, United States
Mansour Moinpour
Affiliation:
mansour.moinpour@intel.com, Intel Corporation, Santa Clara, CA, 95052, United States
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Abstract

Micromachined structures with diameters ranging from 50 — 100 μm have been applied to the measurement of the microscale shearing forces present at the wafer-pad interface during chemical mechanical polishing (CMP). The structures are 80 μm high poly-dimethyl-siloxane posts with bending stiffnesses ranging from 1.6 to 14 μN/μm. The structures were polished using a stiff, ungrooved pad and 3 wt% fumed silica slurry at relative velocities of approximately 0.5 m/s and downforces of approximately 1 psi. Observed lateral forces on the structures were on the order of 5–500 μN, and highly variable in time.

Keywords

CMPmicroelectro-mechanical (MEMS)sensor
Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 1085: Symposium T – Nanoscale Tribology–Impact for Materials and Devices , 2008 , 1085-T05-11
Copyright
Copyright © Materials Research Society 2008

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References

REFERENCES

1. Evans, C., Paul, E., Dornfeld, D., Lucca, D., Byrne, G., Tricard, M., Klocke, F., Dambon, O., and Mullany, B., CIRP Annals- Manufacturing Technology, vol. 52, no. 2, pp. 611–633, 2003.Google Scholar
2. Paul, E., Journal of The Electrochemical Society, vol. 148, p. G359, 2001.Google Scholar
3. Cook, L., Journal of Non-Crystalline Solids, vol. 120, no. 1, pp. 152–171, 1990.Google Scholar
4. Sorooshian, J., Hetherington, D., and Philipossian, A., Electrochemical and Solid-State Letters, vol. 7, p. G222, 2004.Google Scholar
5. Levert, J., Mess, F., Salant, R., Danyluk, S., and Baker, A., Tribology Transactions, vol. 41, no. 4, pp. 593–599, 1998.Google Scholar
6. Lu, J., Rogers, C., Manno, V., Philipossian, A., Anjur, S., and Moinpour, M., Journal of The Electrochemical Society, vol. 151, p. G241, 2004.Google Scholar
7. Basim, G., Vakarelski, I., and Moudgil, B., Journal of Colloid And Interface Science, vol. 263, no. 2, pp. 506–515, 2003.Google Scholar
8. , Feiler, Larson, I., Jenkins, P., and Attard, P., Langmuir, vol. 16, no. 26, pp. 10 269–10 277, 2000.Google Scholar
9. Roure, O. du, Saez, A., Buguin, A., Austin, R., Chavrier, P., Silberzan, P., and Ladoux, B., Proceedings of the National Academy of Sciences, vol. 102, no. 7, p. 2390, 2005.Google Scholar
10. Armani, D., Liu, C., and Aluru, N., Micro Electro Mechanical Systems, 1999. MEMS'99. Twelfth IEEE International Conference on, pp. 222–227, 1999.Google Scholar
11. Sia, S. and Whitesides, G., Electrophoresis, vol. 24, no. 21, pp. 3563–3576, 2003.Google Scholar
12. Hopcroft, M., Kramer, T., Kim, G., Takashima, K., Higo, Y., Moore, D., and Brugger, J., Proc. JSME Adv. Technol. Exp. Mech, pp. 735–742, 2003.Google Scholar