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Microstructure and Mechanical Behavior of Magnetron Sputtered Al-Cu Films

Published online by Cambridge University Press:  26 February 2011

Tsann Lin  and
V. Raman
Tsann Lin
Affiliation:
IBM Corporation, Storage Systems Products Division San Jose, CA 95193
V. Raman
Affiliation:
IBM Corporation, Storage Systems Products Division San Jose, CA 95193
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Abstract

We have investigated the microstructure, electrical resistivity and mechanical behavior of DC magnetron sputtered A1-4wt%Cu films. The substrate temperatures were varied systematically from room temperature to 500 °C. Scanning and transmission electron microscopy of the sputtered films show that the top surface of the films sputtered at low temperatures (< 200 °C) exhibits a pure Al-like fine grain morphology. In contrast, sputter deposition at higher temperatures (> 300 °C) produces films that are characterized at the top surface by a distribution of θ’-A12Cu precipitates with a platelet morphology. The mechanical behavior of the sputtered films were investigated by performing indentation tests using a depth-sensing technique.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 226: Symposium H – Mechanical Behavior of Materials and Structures in Microelectronics , 1991 , 203
Copyright
Copyright © Materials Research Society 1991

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