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Modeling and Controlling During Microwave and Thermal Processing of Composites

Published online by Cambridge University Press:  25 February 2011

Jianghua Wei ,
Ananthapadmanaban Sundaram  and
Martin C. Hawley
Jianghua Wei
Affiliation:
Department of Chemical Engineering, Michigan State University, E. Lansing, MI 48824
Ananthapadmanaban Sundaram
Affiliation:
Department of Chemical Engineering, Michigan State University, E. Lansing, MI 48824
Martin C. Hawley
Affiliation:
Department of Chemical Engineering, Michigan State University, E. Lansing, MI 48824
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Abstract

A process model was developed and coded in FORTRAN to simulate the temperature and the extent of cure profiles across the thickness of the composite during microwave and thermal processing. A simplified five-parameter microwave power absorption model was developed for microwave processing. The computer code was used to predict the behavior of Hercules AS4/3501-6 prepreg during thermal processing using various laminate thickness and boundary conditions. The simulation results show that 4.0 cm is the thickest composite that can be processed with the manufacture's cure cycle. The advantages of microwave processing over thermal processing are fully demonstrated.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 269: Symposium L – Microwave Processing of Materials III , 1992 , 439
Copyright
Copyright © Materials Research Society 1992

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References

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