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Published online by Cambridge University Press: 10 February 2011
Sputter-deposited titanium boride diffusion barrier layers have been found to be boron enriched when r.f substrate bias was applied. In the present experiments titanium boride was deposited by co-sputtering from Ti and B pure targets in Ar discharge and the voltage of r.f. self-bias was in the range of 100 – 250 V. Films deposited were found by Auger electron spectroscopy to be B enriched with increasing bias voltage at constant Ti and B sputtering rates. A model of the sputter-deposition conditions was developed to predict the composition and the thickness of the growing film. The model explains the experimental results indicating that B enrichment is mainly a result of differential resputtering of the components from the growing film by energetic Ar ions captured from the r.f discharge.