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Modelling and Optimal Design of Multilayer Cantilever Microactuators

Published online by Cambridge University Press:  01 February 2011

L. H. Han  and
T. J. Lu
L. H. Han
Affiliation:
Department of Engineering, University of Cambridge Trumpington Street, Cambridge CB2 1PZ, UK
T. J. Lu
Affiliation:
Department of Engineering, University of Cambridge Trumpington Street, Cambridge CB2 1PZ, UK
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Abstract

Thermal expansion is an important actuation mechanism for microelectromechanical system (MEMS). We investigate multi-layered cantilever microactuators actuated by resistive heating with an electric current. The actuator consists of films and sandwiched microheaters. An electrothermal-elastic model for characterizing microactuators is developed. The general analytical expressions relating tip deflection with an applied electric field, temperature change, the film thickness and the applied load at the tip are obtained. The large deflection is considered in the model. The width effect of the cantilever is also investigated using 3D finite element analysis. Based on the analytical solutions and a mixed variable programming (MVP) algorithm, the optimal design of the actuators is presented. The algorithms optimize simultaneously with respect to the number of films and the material choice from a list of candidate materials. The minimum weight and maximum deflection are chosen as the design objectives.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 795: Symposium U – Thin Films - Stresses and Mechanical Properties X , 2003 , U10.11
Copyright
Copyright © Materials Research Society 2004

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References

REFERENCES

1. Allen, R.R., Meyer, J.D., and Knight, W.R., HP Journal, 36, 21–27 (1985).Google Scholar
2. DeVoe, D.L., IEEE Transactions on Components and Packaging Technologies, 25 (4), 576–583 (2003).Google Scholar
3. Wang, Q.M. and Cross, L.E., J. Am. Ceram. Soc., 82 (1), 103–110 (1999).Google Scholar
4. Timoshenko, S.P., J. Optic Soc. Am. Rev. Sci. Inst., 11 (3), 233–255 (1925).Google Scholar
5. Carslaw, H.S. and Jaeger, J.C., Conduction of Heat in Solids. (Oxford: Oxford University Press, 1959).Google Scholar
6. Lu, T.J., Hutchinson, J.W., and Evans, A.G., Journal of the Mechanics and Physics of Solids, 49, 2071–2093 (2001).Google Scholar
7. DeVoe, D.L. and Pisano, A.P., J Microelectromechanical Systems, 6 (3), 266–270 (1997).Google Scholar
8. Gere, J.M. and Timosenko, S.P., Mechanics of Materials. 3rd ed. (PWS-KENT Publishing Co, 1990).Google Scholar
9. Abramson, M.A., Pattern Search Algorithms for Mixed Variable General Constrained Optimization Problems, PhD Thesis, 2003, Rice University.Google Scholar
10. H Han, L. and Lu, T.J., Optimal Design of Thermally Actuated Multilayer Microactuators, Workshop on Optimal Design of Materials and Structures 2003, Paris, France.Google Scholar