Hostname: page-component-78c5997874-94fs2 Total loading time: 0 Render date: 2024-11-10T13:55:11.619Z Has data issue: false hasContentIssue false
  • English
  • Français

Modelling of Joule heating based self-alignment method for metal grid line passivation

Published online by Cambridge University Press:  04 February 2014

M. Janka ,
P. Raumonen ,
S. Tuukkanen  and
D. Lupo
M. Janka
Affiliation:
Department of Electronics and Communications Engineering, Tampere University of Technology, P.O.Box 692, FI-33101 Tampere, Finland
P. Raumonen
Affiliation:
Department of Mathematics, Tampere University of Technology, P.O. Box 553, FI-33101 Tampere, Finland
S. Tuukkanen
Affiliation:
Department of Electronics and Communications Engineering, Tampere University of Technology, P.O.Box 692, FI-33101 Tampere, Finland
D. Lupo
Affiliation:
Department of Electronics and Communications Engineering, Tampere University of Technology, P.O.Box 692, FI-33101 Tampere, Finland
Get access

Abstract

A Joule heating based self-alignment method for solution-processable insulator structures has been modeled for the passivation of metal grid lines, for example for organic light emitting diodes or photovoltaic cells. To minimize overhang of the passivation layer from line edges, we have studied the Joule heating approach using solution-processable, cross-linkable polymer insulator films. Finite element simulations were performed to investigate the heating of the sample using glass and poly(ethylene terephthalate) (PET) substrates. The sample was at room temperature and the current was selected to induce a temperature of 410 K at the conductor. It was found that the selection of substrate material is crucial for the localization of cross-linking. For a PET substrate, the temperature gradient at the edge of the conductor is approximately twice the gradient for glass. As a result, using a glass substrate demands high selectivity from the polymer cross-linking, thus making PET a more suitable substrate material for our application. A flexible PET substrate is, in addition, compatible with roll-to-roll mass-manufacturing processes.

Keywords

passivationsimulationself-assembly
Type
Articles
Information
MRS Online Proceedings Library (OPL) , Volume 1628: Symposium M – Large-Area Processing and Patterning for Active Optical and Electronic Devices , 2014 , mrsf13-1628-m05-52
Copyright
Copyright © Materials Research Society 2014 

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

Choi, S., Potscavage, W. J., and Kippelen, B., J. Appl.Phys. 106, 054507 (2009).CrossRefGoogle Scholar
Neyts, K., Marescaux, M., Nieto, A. U., Elschner, A., Lovenich, W., Fehse, K., Huang, Q., Walzer, K., and Leo, K., J. Appl.Phys. 100, 114513 (2006).CrossRefGoogle Scholar
Janka, M., Tuukkanen, S., Joutsenoja, T., and Lupo, D., Thin Solid Films, 519, 6587 (2011).CrossRefGoogle Scholar
Raumonen, P., Suuriniemi, S., Kettunen, L., IET Sci. Meas. Technol. 2, 286 (2008).CrossRefGoogle Scholar
Saka, M., Sun, Y., Ahmed, S., Int. J. Therm. Sci. 48, 114 (2009).CrossRefGoogle Scholar
Özisik, M, Boundary value problems of heat conduction, (Dover Publications, Mineola, N.Y., 2002) p. 8.Google Scholar
Shewchuk, J. R., Proc. 11th Int. Meshing Roundtable, New York, Ithaca, 115 (2002).Google Scholar
Bejan, A. and Kraus, A. D., Heat Transfer Handbook, (John Wiley & Sons, 2003), p.135.Google Scholar
Brandrup, J., Immergut, E. H., Grulke, E. A. A., and Akihiro Bloch, D. R., Polymer Handbook, 4th ed. (John Wiley & Sons, 1999) p. V/113.Google Scholar
Thuau, D., Koymen, I., and Cheung, R., Microelectronic Engineering. 88, 2408 (2011).CrossRefGoogle Scholar
Jiang, F. X., Xu, J. K., Lu, B. Y., Xie, Y., Huang, R. J., and Li, L. F., Chinese Physics Letters. 25, 2202 ( 2008) .CrossRefGoogle Scholar