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Modification of Nanoporous Silica Structures by FluorocarbonPlasma Treatment

Published online by Cambridge University Press:  17 March 2011

Woojin Cho ,
Ravi Saxena ,
Oscar Rodriguez ,
Ravi Achanta ,
Manas Ojha ,
Joel L. Plawsky ,
William. N. Gill  and
Mikhail R. Baklanov
Woojin Cho
Affiliation:
Department of Chemical and Biological Engineering, Rensselaer Polytechnic Institute, Troy, New York 12180, USA
Ravi Saxena
Affiliation:
Department of Chemical and Biological Engineering, Rensselaer Polytechnic Institute, Troy, New York 12180, USA
Oscar Rodriguez
Affiliation:
Department of Chemical and Biological Engineering, Rensselaer Polytechnic Institute, Troy, New York 12180, USA
Ravi Achanta
Affiliation:
Department of Chemical and Biological Engineering, Rensselaer Polytechnic Institute, Troy, New York 12180, USA
Manas Ojha
Affiliation:
Department of Chemical and Biological Engineering, Rensselaer Polytechnic Institute, Troy, New York 12180, USA
Joel L. Plawsky
Affiliation:
Department of Chemical and Biological Engineering, Rensselaer Polytechnic Institute, Troy, New York 12180, USA
William. N. Gill
Affiliation:
Department of Chemical and Biological Engineering, Rensselaer Polytechnic Institute, Troy, New York 12180, USA
Mikhail R. Baklanov
Affiliation:
IMEC, Leuven, Belgium
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Abstract

Polymerization occurring during fluorocarbon plasma treatment as a potentialmethod for pore sealing was investigated. CHF3 was used as areactant gas to expedite the rate of polymerization due to the presence ofhydrogen and the low C/F ratio. The reactor pressure was varied from 30mTorrto 90mTorr to change the number of neutrals that act as the polymerizingspecies. The films were exposed to the plasma for times of 1min, 3min, and 5min to observe the penetration depth of neutrals and the thickness ofmodified layer as a function of time. Dielectric constants were measuredbefore and after plasma treatment. The film morphology was investigated byscanning electron microscopy before and after plasma treatment and afeatureless surface morphology was observed at 90mTorr on a 56% porosityfilm. After plasma treatment, the average pore neck size decreases which mayhelp reduce metal precursor penetration during metallization.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 812: Symposium F – Materials, Technology and Reliability for Advanced Interconnects and Low-k Dielectrics-2004 , 2004 , F6.7
Copyright
Copyright © Materials Research Society 2004

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