Published online by Cambridge University Press: 28 February 2011
We studied the selective epitaxial deposition of silicon in patterned oxide-free regions over silicon dioxide in a RF-heated, commercial, reduced-pressure epitaxial reactor, using SiH2Cl2/HCl/H2 gas system. We found that etching into silicon occurs at the high end of HCl content, and nucleation on the silicon dioxide at the low end of HCl content. The selective epitaxial growth of silicon islands is obtained in between.
Present address: Honeywell Solid State Laboratory, Plymouth, MN 55441