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Multi-Chip-Module Interconnections by Laser Direct Writing

Published online by Cambridge University Press:  25 February 2011

Heinrich G. Müller ,
Alvaro Paredes ,
Klaus Buschick  and
Herbert Reichl
Heinrich G. Müller
Affiliation:
Technische Universität Berlin, Sekr. TIB 4–2, Gustav-Meyer-Allee 25, D–1000 Berlin 65, Germany
Alvaro Paredes
Affiliation:
Technische Universität Berlin, Sekr. TIB 4–2, Gustav-Meyer-Allee 25, D–1000 Berlin 65, Germany
Klaus Buschick
Affiliation:
Technische Universität Berlin, Sekr. TIB 4–2, Gustav-Meyer-Allee 25, D–1000 Berlin 65, Germany
Herbert Reichl
Affiliation:
Technische Universität Berlin, Sekr. TIB 4–2, Gustav-Meyer-Allee 25, D–1000 Berlin 65, Germany
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Abstract

A very flexible maskless technique for thin film hybrid formation has been developed. Lay outs are transferred directly from work stations to laser controls. Openings in ceramic substrates are achieved through laser cutting, and chips are embedded to give a common chip-to-substrate surface, flat to within 2 μm. Dielectric layers of polyimide are formed by spin on techniques and are then laser structured for via hole formation.

Interconnections of the embedded chips are generated by laser direct writing of thin copper lines from copper formate, followed by chemical copper deposition. Chemical pretreatments of the aluminum contact pads allow for reasonable chip contacting with these methods. Electrical measurements on the dc line conductivity and the high frequency behaviour of these interconnections have also been performed.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 203: Symposium D – Electronic Packaging Materials Science V , 1990 , 369
Copyright
Copyright © Materials Research Society 1991

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References

REFERENCES

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