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The Nanomechanical Effect of Dendrimer Interlayers Underneath Cu Ultrathin Films

Published online by Cambridge University Press:  11 February 2011

Junyan Zhang ,
Micheal Curry  and
Shane Street
Junyan Zhang
Affiliation:
Center for Materials for Information Technology and Chemistry Department, University of Alabama, Tuscaloosa, AL 35487
Micheal Curry
Affiliation:
Center for Materials for Information Technology and Chemistry Department, University of Alabama, Tuscaloosa, AL 35487
Shane Street
Affiliation:
Center for Materials for Information Technology and Chemistry Department, University of Alabama, Tuscaloosa, AL 35487
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Abstract

Two kinds of dendrimers, DAB and PAMAM (with the same terminal groups but different branched repeat units), were chosen as interlayers for Cu ultrathin films deposited on native oxide Si(100) wafers. 10 nm Cu thin films were deposited directly on the dendrimer monolayers by DC sputtering at room temperature. The nanomechanical results show that PAMAM and DAB have significant effects on the properties of the resulting films, with the DAB layer acting as a stiffer ‘spring’, compared to PAMAM, underneath the Cu films. Both dendrimer interlayers lower the hardness of the film, compared to Cu alone; the effect is greater for PAMAM than DAB interlayers. However, the introduction of either dendrimer monolayer significantly increased the elasticity of the Cu film.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 734: Symposia A/B – Defect-Mediated Phenomena in Ordered Polymers – Polymer/Metal Interfaces and Defect Mediated Phenomena in Ordered Polymers , 2002 , B9.51
Copyright
Copyright © Materials Research Society 2003

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References

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