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The Nanoporous Metallisation of Insulating Substrates through Photocatalytically Initiated Electroless Deposition (PIED)

Published online by Cambridge University Press:  01 March 2012

Michael A. Bromley  and
Colin Boxall
Michael A. Bromley
Affiliation:
Lancaster University, Engineering Department, Lancaster LA1 4YR, United Kingdom. E-mail addresses: m.bromley@lancaster.ac.uk, c.boxall@lancaster.ac.uk
Colin Boxall
Affiliation:
Lancaster University, Engineering Department, Lancaster LA1 4YR, United Kingdom. E-mail addresses: m.bromley@lancaster.ac.uk, c.boxall@lancaster.ac.uk
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Abstract

We report the novel use of semiconductor photocatalysis for the deposition of metal onto insulating surfaces and the in-process formation of nano-structured porosity within this metal. In the process of Photocatalytically Initiated Electroless Deposition (PIED) we have developed a controllable, spatially selective and versatile metallisation technique with several advantages over traditional, non-photocatalytic techniques such as enhanced controllability and purity of the deposit as well as reduced operational costs and environmental impact. With the addition of a self-assembled, hexagonally close-packed microparticle template to the substrate prior to metal deposition, PIED can be used to fabricate thin metal films with highly ordered porosity on the nano-scale. Nanoporous metallisation in this way is able to produce substrates with potentially wide applications such as membrane and separation technology, energy storage and sensors – especially surface enhanced resonance Raman spectroscopy (SERRS).

Keywords

photochemicalplatingnanostructure
Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 1409: Symposium CC – Functional Semiconductor Nanocrystals and Metal-Hybrid Structures , 2012 , mrsf11-1409-cc05-20
Copyright
Copyright © Materials Research Society 2012

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References

REFERENCES

[1]. Mallory, G. O., in Electroless Plating - Fundamentals and Applications (1990), pp. 511–517.Google Scholar
[2]. Mills, A. and Le Hunte, S., Journal of Photochemistry and Photobiology A: Chemistry 108 (1), 1-35 (1997).Google Scholar
[3]. Bromley, M. A., Boxall, C., Galea, S., Goodall, P. S. and Woodbury, S., Journal of Photochemistry and Photobiology A: Chemistry 216 (2–3), 228-237 (2010).Google Scholar
[4]. Bromley, M. A. and Boxall, C., International Patent PCT/GB2011/001402 (2011).Google Scholar
[5]. Bromley, M. A. and Boxall, C., in Advances in Chemistry Research, edited by Taylor, J. C. (Nova Publishers, 2011), Vol. 13.Google Scholar
[6]. Yu, J., Zhaoa, X., Zhaoa, Q. and Wang, G., Materials Chemistry and Physics 68, 253–259 (2001).Google Scholar
[7]. Denkov, N. D., Velev, O. D., Kralchevsky, P. A. and Ivanov, I. B., Langmuir 8, 3183–3190 (1992).Google Scholar
[8]. Denkov, N. D., Kralchevsky, P. A. and Ivanov, I. B., Journal of Dispersion Science and Technology 18, 577–591 (1997).Google Scholar
[9]. Yu, J. C., Yu, J., Ho, W. and Zhao, J., Journal of Photochemistry and Photobiology A: Chemistry 148, 331–339 (2001).Google Scholar