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Newly Developed Low-Density Methylsiloxane Spin-On-Glass Films

Published online by Cambridge University Press:  10 February 2011

Noriko Yamada  and
Toru Takahashi
Noriko Yamada
Affiliation:
Advanced Technology Research Laboratories, Nippon Steel Corporation 3–35–1, Ida, Nakahara-Ku, Kawasaki 211–0035, JAPAN, nyamada@labI.nsc.co.jp
Toru Takahashi
Affiliation:
Advanced Technology Research Laboratories, Nippon Steel Corporation 3–35–1, Ida, Nakahara-Ku, Kawasaki 211–0035, JAPAN, nyamada@labI.nsc.co.jp
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Abstract

Spin-on-glass (SOG) solution has been prepared from methyltriethoxysilane and dimethoxymethyl-3,3,3-trifluoropropylsilane. Trifluoropropyl groups attached to silicon are thermally decomposed by curing at 450°C in nitrogen. Since the overall methylsiloxane network is maintained without a significant shrinkage upon the thermal decomposition of trifluoropropyl groups, vacant spaces whose sizes are comparable to those of trifluoropropyl groups are introduced into the methylsiloxane network, leading to the low-density film with the Brunauer, Emmet and Teller (BET) surface area of 270 m2/g. The film shows the dielectric constant of 2.3, heat stability, low moisture uptake, good planarization property and no corrosion toward aluminum conducting lines.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 565: Symposium O – Low-Dielectric Constant Materials V , 1999 , 279
Copyright
Copyright © Materials Research Society 1999

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