Hostname: page-component-745bb68f8f-hvd4g Total loading time: 0 Render date: 2025-01-28T13:58:27.812Z Has data issue: false hasContentIssue false
  • English
  • Français

Optimization Of Technology And Design Parameters Of IGBT Using TWB

Published online by Cambridge University Press:  10 February 2011

B. Fatemizadehl  and
Y. Granik
B. Fatemizadehl
Affiliation:
Technology Modeling Associates, Inc., 595 Lawrence Exp., Sunnyvale, CA 94086, USA(408) 328–0930, (408) 3280940
Y. Granik
Affiliation:
Technology Modeling Associates, Inc., 595 Lawrence Exp., Sunnyvale, CA 94086, USA(408) 328–0930, (408) 3280940
Get access

Abstract

This paper presents a methodology to optimize the design of different types of IGBT using TWB (TMA WorkBench). Using RSM (Response Surface Modeling) and DOE (Design of Experiment) in TWB we have developed a methodology, which can be applied to explore the impact of design modifications on the speed improvement and study the trade-off between speed, on-resistance, and breakdown voltage of IGBT. This method is a rapid and cost-effective approach for studying design alternatives. Two-dimensional simulations were used to determine the influence of technology and design parameter on device characteristics.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 483: Symposium E – Power Semiconductor Materials & Devices , 1997 , 357
Copyright
Copyright © Materials Research Society 1998

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1. Axelrad, V., Granik, Y. and Jewell, R., Microelectronics Journal 26, 191 (1995).Google Scholar
2. TMA Workbench, User's Manual, Version 2.2 (Technology Modeling Associates, Inc., Sunnyvale, 1997).Google Scholar
3. Boning, D. S. and Mozumder, O. K., IEEE Transaction on Semiconductor Manufacturing 7, 233, (1994).Google Scholar
4. Avarez, A. R., Abdi, B. L., Young, D. L., Weed, H. D., Teplik, J., and Herlad, E. R., IEEE Transaction Computer Aided Design 7, 16, (988).Google Scholar