Hostname: page-component-cd9895bd7-dk4vv Total loading time: 0 Render date: 2024-12-30T23:35:58.887Z Has data issue: false hasContentIssue false
  • English
  • Français

Pad Degradation During CMP Process: Effect of Soak in Slurry and Water on Thermal and Mechanical Properties of the CMP Pads

Published online by Cambridge University Press:  01 February 2011

A. Tregub ,
G. Ng  and
M. Moinpour
A. Tregub
Affiliation:
Intel Corporation, Fab Material Operations, Santa Clara, CA.
G. Ng
Affiliation:
Intel Corporation, Fab Material Operations, Santa Clara, CA.
M. Moinpour
Affiliation:
Intel Corporation, Fab Material Operations, Santa Clara, CA.
Get access

Abstract

Soak of polyurethane-based CMP pads in tungsten slurry and de-ionized water and its effect on retention of thermal and mechanical properties of the pads was studied using Dynamic Mechanical Analysis (DMA), Thermal Mechanical Analysis (TMA), Thermal Gravimetric Analysis (TGA), and Modulated Differential Scanning Calorimetry (MDSC). Simultaneous cross-linking and plastisizing due to soak were established using DMA and MDSC analysis. The stable operating temperature range and its dependence on soak time were determined using TMA analysis. Substantial difference in diffusion behavior of the “soft” and “hard” pads was discovered: diffusion into the hard pads followed Fickian law [1], while diffusion into the multi-layer soft pads was dominated by the fast filling of the highly porous pad surface with liquid.

During a traditional CMP process, which involves application of polishing pads and slurry, the pad properties can be substantially and irreversibly changed as the result of slurry/rinse water absorption.

The retention of the pad properties after exposure was monitored using such thermal and mechanical techniques, as Thermal Mechanical Analysis (TMA), Dynamical Mechanical Analysis (DMA), Modulated Differential Scanning Calorimetry (MDSC), Thermal Gravimetric Analysis (TGA).

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 767: Symposium F – Chemical-Mechanical Planarization , 2003 , F2.6
Copyright
Copyright © Materials Research Society 2003

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1. Moinpour, M., Tregub, A., Oehler, A., Cadien, K.. Advances in Characterization of CMP consumables, MRS Bulletin, October 2002, 27, no. 10, pp. 766–771 (invited review).Google Scholar
2. Tregub, A., Moinpour, M., Sorooshian, J., Effect of CMP Pad Exposure to Aqueous Media on the Pad Properties: Part 1. Dynamic Mechanical and Modulated DSC Analysis, I5.4, 2002 Spring Meeting Proceedings, Symposium I, Chemical-Mechanical Planarization, Editors: Babu, S.V., Singh, R., Hayasaka, N., Oliver, M., MRS Proceedings Volume 732E.Google Scholar
3. Tregub, A., Pham, C., Inglehart, M., R. Friedrich. Effect of Cure on the Mechanical and Thermoanalytical Properties of Phenolic Resins and Composites, Proceedings of SAMPE Technical Conference, Orlando, November 1997 Google Scholar
4. Dickie, B. D.. Investigation of an engineering thermoplastic polyurethane by MDSC, Thermochimica Acta, 304–305, 3, November 1997, pp. 347–352 Google Scholar