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Pattern Symmetry and CMP Process Simulation

Published online by Cambridge University Press:  01 February 2011

Takafumi Yoshida
Takafumi Yoshida*
Affiliation:
YNT-jp.Com 2-10-17 Asae, Hikari, Yamaguchi 743-0021, Japan
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Abstract

This paper reviews the effect of pattern symmetry on Chemical Mechanical Planarization (CMP) and proposes a methodology to reduce the computational time of the CMP process simulation based on the boundary element method (BEM). We focus on a unit field which generates the symmetry structures and we formulate the BEM field matrix by parallel translations and spin/flip operations. We also discuss the characteristics of the field matrix and demonstrate the applications of the methodology.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 867: Symposium W – Chemical-Mechanical Planarization-Integration, Technology and Reliability , 2005 , W6.7
Copyright
Copyright © Materials Research Society 2005

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References

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