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Performance of Thin Film Silicon MEMS on Flexible Plastic Substrates

Published online by Cambridge University Press:  01 February 2011

Samadhan Patil ,
Virginia Chu  and
Joao Pedro Conde
Samadhan Patil
Affiliation:
spatil@inesc-mn.pt, INESC MN, n/a, Rua Alves Redol, 9, Lisbon, 1000-029, Portugal, +351-21-3100237, +351-21-3145843
Virginia Chu
Affiliation:
vchu@inesc-mn.pt, INESC MN, n/a, Rua Alves Redol, 9, Lisbon, 1000-029, Portugal
Joao Pedro Conde
Affiliation:
joao.conde@ist.utl.pt, INESC MN, n/a, Rua Alves Redol, 9, Lisbon, 1000-029, Portugal
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Abstract

Microresonators based on thin film hydrogenated amorphous silicon microbridges were fabricated by surface micromachining on flexible polyethylene terephthalate (PET) substrates with a maximum processing temperature of 110°C. An aluminum sacrificial layer is used which is patterned by either wet etching or lift-off. Resonance in the MHz range was observed using electrostatic actuation. Processing of the microbridges on PET with sacrificial layer patterned by lift-off has higher yield than by etching. Bending measurements show that the thin film silicon microbridges on PET can withstand a higher compressive strain (-2.5%) than tensile strain (1.25%).

Keywords

microelectro-mechanical (MEMS)thin filmpolymer
Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 989: Symposium A – Amorphous and Polycrystalline Thin-Film Silicon Science and Technology-2007 , 2007 , 0989-A10-02
Copyright
Copyright © Materials Research Society 2007

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References

1See, for example, Street, R A, Hydrogenated Amorphous Silicon, Cambridge University Press, Cambridge, 1991.Google Scholar
2 Petersen, K E, Guarnieri, C R, J. Appl. Phys. 50, 6761 (1979).Google Scholar
3See, for example, Elwenspoeck, M and Wiegerink, R, Mechanical Microsensors, Springer, Berlin, 2001.Google Scholar
4 Boucinha, M, Brogueira, P, Chu, V, and Conde, J P, Appl. Phys. Lett. 77, 907 (2000).Google Scholar
5 Gaspar, J, Chu, V, Louro, N, Cabeca, R, and. Conde, J P, J. Non-Cryst. Solids, 299–302, 1224 (2002).Google Scholar
6 Syllaios, A J, Schimert, T R, Gooch, R W, McCarde, W L, Ritchey, B A and Tregilgas, J H, Mater. Res. Soc. Symp. Proc. 609, A14.4.1 (2000).Google Scholar
7 Gleskova, H, Wagner, S and Suo, Z, Mat. Res. Soc. Symp. Proc. 557, 653 (1999).Google Scholar
8 Servati, P., Nathan, A., Appl. Phys. Lett. 86, 033504 (2005)Google Scholar
9 Louro, P, Vieira, M, Fernandes, M and Schubert, M, Optical Materials, 27 no. 5, 1069–1073 (2005).Google Scholar
10 Klauk, H, Schmid, G, Radlik, W, Weber, W, Zhou, L, Sheraw, C D, Nichols, J A and Jackson, T N, Solid State Electronics, 47 (2), 297 (2003).Google Scholar
11 Taehyoung, Z, Kim, S H, Chu, H Y, Lee, J H, Lim, S C, Jeong-Ik, L, Jiyoung, O, Flexible electronics technology, Part I: Systems & applications, 93 (7), 1265–1272 (2005).Google Scholar
12 Gaspar, J, Chu, V and Conde, J P, J. Appl. Phys. 93, 10018 (2003).Google Scholar
13 Gaspar, J, Chu, V and Conde, J P, J. Appl. Phys. 97, 094501 (2005).Google Scholar
14 Cleland, A N, Foundations of Nanomechanics- From Solid State Theory to Device Applications, Springer, Berlin, 2003, p. 209 Google Scholar