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Photo-Polymer Wafer Bonding for Double Layer Transfer

Published online by Cambridge University Press:  02 August 2011

Vorrada Loryuenyong ,
Tim Sands  and
Nathan W. Cheung
Vorrada Loryuenyong
Affiliation:
Department of Materials Science & Engineering, University of California-Berkeley, Berkeley, CA 94720
Tim Sands
Affiliation:
Department of Materials Science & Engineering, University of California-Berkeley, Berkeley, CA 94720 School of Materials Engineering and School of Electrical & Computer Engineering, Purdue University, W. Lafayette, IN 47907-2036
Nathan W. Cheung
Affiliation:
Department of Electrical Engineering and Computer Sciences, University of California-Berkeley, Berkeley, CA 94720
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Abstract

Temporary bonding is necessary for the two-stage transfer of thin films from one substrate to another while preserving the original orientation of the film. The process developed in this study uses an SU-8 photo-polymer both as a bonding material and as a delamination material for layer transfer. SU-8 was spun onto an optically transparent handle wafer (e.g., quartz or glass) and then bonded to the layer to be transferred. The processing parameters such as pre-baking temperature and UV exposure dose affect the bonding strength. UV curing of the SU-8 through the backside of the handle wafer could be performed to obtain the ultimate bond strength at low temperatures. A laser pulse from a KrF excimer laser (λ = 248 nm and λ = 38 ns) at a fluence of 50-150 mJ/cm2 was used to delaminate the SU-8 bonding layer to complete the layer transfer.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 768: Symposium G – Integration of Heterogeneous Thin-Film Materials and Devices , 2003 , G5.6
Copyright
Copyright © Materials Research Society 2003

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