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Pore Seal Property of Ultra-thin Layer for Porous Low-k Films revealed by Ellipsometric Porosimetry

Published online by Cambridge University Press:  30 July 2012

Shoko Sugiyama Ono ,
Yasuhisa Kayaba ,
Tsuneji Suzuki ,
Hirofumi Tanaka  and
Kazuo Kohmura
Shoko Sugiyama Ono
Affiliation:
R&D Center, Mitsui Chemicals, Inc., 580-32, Nagaura, Sodegaura, Chiba, 299-0265, Japan
Yasuhisa Kayaba
Affiliation:
R&D Center, Mitsui Chemicals, Inc., 580-32, Nagaura, Sodegaura, Chiba, 299-0265, Japan
Tsuneji Suzuki
Affiliation:
R&D Center, Mitsui Chemicals, Inc., 580-32, Nagaura, Sodegaura, Chiba, 299-0265, Japan
Hirofumi Tanaka
Affiliation:
R&D Center, Mitsui Chemicals, Inc., 580-32, Nagaura, Sodegaura, Chiba, 299-0265, Japan
Kazuo Kohmura
Affiliation:
R&D Center, Mitsui Chemicals, Inc., 580-32, Nagaura, Sodegaura, Chiba, 299-0265, Japan
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Abstract

It was found for the first time that the control of the size of pore sealant is important to prevent diffusions of pore sealant into pores of porous low-k films and to achieve a good toluene seal property. Two pore sealants (PS-A, B) were prepared and the seal property and porous structure were studied using toluene based ellipsometric porosimetry (EP) measurements. It was revealed that small pore sealant (PS-B) diffuses into pores of porous low-k (PLK) films and did not show any seal property, while large pore sealant (PS-A) does not diffuse into pores of porous low-k films and shows a good toluene seal property. Ellipsometry shows that PS-A forms conformal layer only on the vicinity of surface of porous low-k films, but porous structure of porous low-k films at the bottom part is kept, according the fact that the refractive index did not increase.

Furthermore, we developed a new pore seal material (PS-C) to form ultra-thin conformal layer by a single pass, which shows a good toluene seal property. The dielectric constant increased from 2.10 to 2.25 by covering with PS-C. The obtained layer also shows the effect as the protect layer of porous low-k films from plasma damages.

Keywords

barrier layerdielectricsolution deposition
Type
Articles
Information
MRS Online Proceedings Library (OPL) , Volume 1428: Symposium C – Interconnect Challenges for CMOS Technology—Materials, Processes and Reliability for Downscaling, Packaging and 3D Stacking , 2012 , mrss12-1428-c01-04
Copyright
Copyright © Materials Research Society 2012

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References

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