Hostname: page-component-78c5997874-94fs2 Total loading time: 0 Render date: 2024-11-14T07:03:43.425Z Has data issue: false hasContentIssue false
  • English
  • Français

Preparation and Characterization Silver and Copper Layers on Polyimide Prepared by Electroless Copper Plating

Published online by Cambridge University Press:  01 February 2011

Eun Sun Ji ,
Young Hwan Kim  and
Young Soo Kang
Eun Sun Ji
Affiliation:
yskang@pknu.ac.kr, Pukyong National University, Department of Chemistry, 599-1, Daeyeon 3-dong, Namgu, Busan, 608-737, Republic of Korea
Young Hwan Kim
Affiliation:
Pukyong National University, Department of Chemistry, 599-1, Daeyeon 3-dong, Namgu, Busan, 608-737, Republic of Korea
Young Soo Kang
Affiliation:
yskang@pknu.ac.kr, Pukyong National University, Department of Chemistry, 599-1, Daeyeon 3-dong, Namgu, Busan, 608-737, Republic of Korea
Get access

Abstract

Ag particles were generated on Ag+-doped polyimide film by ion exchanging, followed by copper deposition using metallic silver particles as seeds. The Cu layers were coated on the surface of polyimide films by electroless plating method. The surface image and morphology of Cu layers on the polyimide films were characterized with scanning electron microscopy (SEM), and atomic force microscopy (AFM). The chemical composition on the PI film was investigated energy dispersive X-ray (EDX) spectrometer.

Keywords

CuplatingAg
Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 947: Symposium A – Responsive Soft Matter – Chemistry and Physics for Assemblages, Films and Forms , 2006 , 0947-03-05
Copyright
Copyright © Materials Research Society 2007

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1. Jou, W. S., Cheng, H. Z., Hsu, C. F., Alloys, J. and com. (in press)Google Scholar
2. Park, K. Y., Lee, S. E., Kim, C. G., Han, J. H., Composite Structures. (in press)Google Scholar
3. Wang, W. C., Vora, R. H., Kang, E. T., Neoh, K. G., Liaw, D. J., Ind. Eng. Chem. Res. 42, 784 (2003)Google Scholar
4. Wang, W. C., Vora, R. H., Kang, E. T., Neoh, K. G., Poly. Eng. Sci. 44, 362 (2004)Google Scholar
5. Plechaty, M. M., Thomas, R. R., J. Electrochem. Soc. 139, 810 (1992)Google Scholar
6. Kreuz, J. A., Edman, J. R., Adv. Mater. 10, 1229 (1998)Google Scholar
7. Akamatsu, K., Ikeda, S., Nawafune, H., Yanagimoto, H., J. Am. Chem. Soc. 126, 10822 (2004)Google Scholar
8. Akamatsu, K., Ikeda, S., Nawafune, H., Yanagimoto, H., Langmuir. 19, 10366 (2004)Google Scholar
9. Yu, W.-X., Hong, L., Chen, B-H., Ko, T.-M., J. Mater. Chem. 13, 818 (2003)Google Scholar