Hostname: page-component-745bb68f8f-b6zl4 Total loading time: 0 Render date: 2025-02-05T21:27:03.950Z Has data issue: false hasContentIssue false
  • English
  • Français

Process Dependence of Microstructure and Properties of Sintered Aluminum Nitride for Electronic Packaging

Published online by Cambridge University Press:  15 February 2011

I. Dutta ,
S. Mitra  and
J. Cooper
I. Dutta
Affiliation:
Department of Mechanical Engineering, Naval Postgraduate School, Monterey, CA 93943
S. Mitra
Affiliation:
Department of Mechanical Engineering, Naval Postgraduate School, Monterey, CA 93943
J. Cooper
Affiliation:
Department of Mechanical Engineering, Naval Postgraduate School, Monterey, CA 93943
Get access

Abstract

The development of secondary phases due to additions of Y2O3 during sintering of aluminum nitride was studied. Depending on the heat treatment conditions and the amount of Y2O3 added, different proportions of AlYO3, Al5Y3O12 and Al2Y4O9 were found at the grain boundaries. Temperatures ≳1850°C also resulted in loss of Y2O3 and/or Y-aluminate, yielding some γAl2O3. The mechanical properties and the thermal conductivity of the sintered product were observed to be dependent on the grain boundary phase constitution and hence the specific heat treatment condition.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 264: Symposium G – Electronic Packaging Materials Science VI , 1992 , 395
Copyright
Copyright © Materials Research Society 1992

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1. Slack, G. A., J. Phys. Chem. Solids, 34, 321 (1973).CrossRefGoogle Scholar
2. Virkar, A. V., Jackson, T. B. and Cutler, R. A., J. Am. Cer. Soc., 72, 2031 (1989).Google Scholar
3. Harris, J. H., Youngman, R. A. and Teller, R. G., J. Mater. Res., 5, 1763 (1990).Google Scholar
4. Komeya, K., Inoue, H. and Tsuge, A., Yogyo-Kyokaishi, , 89, 330 (1981).CrossRefGoogle Scholar
5. Prochazka, S. and Bobik, C. F., Mater. Sci. Res., 13, 321 (1980).Google Scholar
6. Troczynski, T. B. and Nicholson, P. S., J. Am. Ceram. Soc., 72, 1488 (1989).Google Scholar
7. VanDamme, N. S., Richard, S. M. and Winzer, S. R., J. Am. Ceram. Soc. 72, 1409 (1989).Google Scholar
8. Horvath, S. F., Witek, S. R. and Harmer, M. P. in Advances in Ceramics, Vol. 26, Proc. Intl. Symp. Ceramics Substrates and Packages, Am. Cer. Soc. (1989) p. 121.Google Scholar
9. Kuramoto, N., Taniguchi, H., Numata, Y. and Aso, I., Yogyo-Kyokaishi, , 93, 517 (1985).Google Scholar
10. Kuramoto, N., Taniguchi, H. and Aso, I., Am. Ceram. Soc. Bull., 68, 883 (1989).Google Scholar
11. Topfer, U. and Muller, G., Ceram. Forum. Int., 65, 588 (1988).Google Scholar
12. Youngman, R. A. and Chemoff, D. A., Am. Ceram. Soc. Bull., 66 1233 (1987).Google Scholar
13. Takahashi, T., Iwase, N., Tsuge, A. and Nagata, M., Advances in Ceramics, Vol.26, Proc. Intl. Symp. Ceramics Substrates and Packages, Am. Cer. Soc. (1989) p. 159.Google Scholar
14. Enloe, J. H., Rice, R. W., Lau, J. W., Kumar, R. and Lee, S. Y., J. Am. Cer. Soc., 74, 2214 (1991).Google Scholar
15. Phase Diaerams for Ceramists, Reser, M., editor, Am. Ceram. Soc. (1969) p. 96.Google Scholar