Published online by Cambridge University Press: 01 February 2011
The successful implementation of silicon nanowire (NW)-based tunnel-field effect transistors (TFET) critically depends on gaining a clear insight into the quantitative carrier distribution inside such devices. Therefore, we have developed a method based on scanning spreading resistance microscopy (SSRM) which allows quantitative two-dimensional (2D) carrier profiling of fully integrated NW-based TFETs with 2 nm spatial resolution. The keys in our process are optimized NW cleaving and polishing steps, in-house fabricated diamond tips with ultra-high resolution, measurements in high-vacuum and a dedicated calibration procedure accounting for dopant dependant carrier mobilities.