Hostname: page-component-6bf8c574d5-t27h7 Total loading time: 0 Render date: 2025-02-22T16:23:41.778Z Has data issue: false hasContentIssue false
  • English
  • Français

Rapid Preparation of Cross-Sectional TEM Samples from Electroplated Copper

Published online by Cambridge University Press:  16 February 2011

T. E. Dinan ,
D. Landolt ,
P Ruterana  and
P.-A. Buffat
T. E. Dinan
Affiliation:
Ecole Polytechnique Fédérale de Lausanne, DMX-LMCH, Lausanne, Switzerland
D. Landolt
Affiliation:
Ecole Polytechnique Fédérale de Lausanne, DMX-LMCH, Lausanne, Switzerland
P Ruterana
Affiliation:
Ecole Polytechnique Fédérale de Lausanne, I2M, Lausanne, Switzerland
P.-A. Buffat
Affiliation:
Ecole Polytechnique Fédérale de Lausanne, I2M, Lausanne, Switzerland
Get access

Abstract

Methods were investigated for the rapid preparation of cross-sectional TEM samples from electroplated copper. Electropolishing and ultramicrotomy were used. The electropolished samples were sandwiched in a copper/nickel alloy and electropolished using a nitric acid/methanol mixture. Large transparent areas were obtained and it was possible to position the area of interest at the point where the hole would appear. Ultramicrotomed samples cut with 45° diamond knives were electron transparent but the crystalline structure of the sample was severely damaged. However, it was possible to identify the conditions by which good ultramicrotomed samples might be produced in the future.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 199: Symposium W – Specimen Preparation for Transmission Electron Microscopy of Materials II , 1990 , 281
Copyright
Copyright © Materials Research Society 1990

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1. Chene, Olivier, PhD thesis, No. 820, pp.118–122, Swiss Federal Institute of Technology, Switzerland, 1989.Google Scholar
2. Newcomb, S.B., Baxter, C.S. and Bithell, E.G., Inst. Phys. Conf. Ser. No. 93, 1, 43 (1988).Google Scholar
3. Ahlers, M. and Vassamillet, L.E, J. Appl. Phys. 32, 3592 (1968).Google Scholar
4. Victor Phillips, A., Prakt. Metall., 4, 637 (1967).Google Scholar
5. Jésior, J.-C., J. Ultrastruct. Res., 95, 210 (1986).Google Scholar