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Rapid Verticai Processor for Fast-Ramp Small-Batch Diffusion and Oxidation Applications

Published online by Cambridge University Press:  10 February 2011

Cole Porter ,
Allan Laser  and
Christopher Ratliff
Cole Porter
Affiliation:
Silicon Valley Group Inc., Thermco Systems Division, 2240 Ringwood Ave., San Jose, CA 95131
Allan Laser
Affiliation:
Silicon Valley Group Inc., Thermco Systems Division, 2240 Ringwood Ave., San Jose, CA 95131
Christopher Ratliff
Affiliation:
Silicon Valley Group Inc., Thermco Systems Division, 1465 N. Batavia St., Orange, CA 92667–3583
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Abstract

Fast-ramp small-batch vertical furnace technology improves batch furnace processing capabilities. Reducing cycle time and improving diffusion control while still maintaining a low cost of ownership and film thickness uniformity are the key benefits of this new technology. A new high power density furnace has been designed to accommodate accelerated wafer temperature ramp up and cool down rates. Unique quartz fixturing is also used to minimize thermal stress across the wafers. This paper will describe both thermal uniformity and film uniformity results for a 65Å Gate Oxide Process for the Rapid Vertical Processor (RVP). In addition, thermal stress data and throughput results will be presented.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 470: Symposium F – Rapid Thermal and Integrated Processing IV , 1997 , 207
Copyright
Copyright © Materials Research Society 1997

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References

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