Published online by Cambridge University Press: 26 February 2011
We have deposited thin Ge films on GaAs(111) crystals over a temperature range of 250-400° C by Remote Plasma Enhanced Chemical Vapor Deposition (RPECVD). Rutherford Backscattering (RBS)/channelinf analysis of these heteroepitaxial films were carried out using 2.07 MeV He ions channeled along the <111> axis. RBS/channeling analysis showed that the best Ce films were grown at a substrate temperature of 300° C. The minimum yield for <111> channeling on films deposited at 300° C was 0.08, slightly greater than that of the GaAs crystal. Films grown at temperatures below 300° C showed poor epitaxy. No channeling was observed for the film grown at 250° C. Films grown at substrate temperatures above 350° C showed high dechanneling near the interface and poor epitaxy indicating films are highly defective. The RBS/channeling results are correlated with microstructural characterization using transmission electron microscopy of these films.