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RF SOP (System On Package) Using Passive Embedded Substrate

Published online by Cambridge University Press:  01 February 2011

NamKee Kang ,
Junchul Kim ,
Dongsu Kim ,
ChanSei Yoo ,
JongIn Ryu  and
Hyunmin Cho
NamKee Kang
Affiliation:
kangnk@keti.re.kr, KOREA ELECTRONIC TECHNOLOGY INSTITUTE, ELECTRONIC MATERIALS & DEVICE PACKAGING RESEARCH CENTER, # 68 Yatap-dong, Bundang-gu, Seongnamsi, Gyeonggi-do, 463-816, Korea, Republic of, 82-31-789-7210, 82-31-789-7209
Junchul Kim
Affiliation:
kimjc@keti.re.kr, KOREA ELECTRONIC TECHNOLOGY INSTITUTE, ELECTRONIC MATERIALS & DEVICE PACKAGING RESEARCH CENTER, # 68 Yatap-dong, Bundang-gu, Seongnamsi, Gyeonggi-do, 463-816, Korea, Republic of
Dongsu Kim
Affiliation:
kimds@keti.re.kr, KOREA ELECTRONIC TECHNOLOGY INSTITUTE, ELECTRONIC MATERIALS & DEVICE PACKAGING RESEARCH CENTER, # 68 Yatap-dong, Bundang-gu, Seongnamsi, Gyeonggi-do, 463-816, Korea, Republic of
ChanSei Yoo
Affiliation:
ychs@keti.re.kr, KOREA ELECTRONIC TECHNOLOGY INSTITUTE, ELECTRONIC MATERIALS & DEVICE PACKAGING RESEARCH CENTER, # 68 Yatap-dong, Bundang-gu, Seongnamsi, Gyeonggi-do, 463-816, Korea, Republic of
JongIn Ryu
Affiliation:
aceryu@keti.re.kr, KOREA ELECTRONIC TECHNOLOGY INSTITUTE, ELECTRONIC MATERIALS & DEVICE PACKAGING RESEARCH CENTER, # 68 Yatap-dong, Bundang-gu, Seongnamsi, Gyeonggi-do, 463-816, Korea, Republic of
Hyunmin Cho
Affiliation:
chomin@keti.re.kr, KOREA ELECTRONIC TECHNOLOGY INSTITUTE, ELECTRONIC MATERIALS & DEVICE PACKAGING RESEARCH CENTER, # 68 Yatap-dong, Bundang-gu, Seongnamsi, Gyeonggi-do, 463-816, Korea, Republic of
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Abstract

The convergence paradigm of today, which can be characterized as multi function and high effectiveness, strongly requires an integration of RF/analog function and high-speed digital function into a single IC or package. System on Package (SOP) is a promising technology for system integration in order to meet these current trends and requirements. A passive embedded substrate is one of the most critical issues to achieve small-size and high-functional devices and modules with high integration density and deign flexibility for wireless communications.

This paper will describe integration approach for passive embedded substrate for RF applications. With the several examples such as multi-band front end module and passive/active integrated modules, the advantages of the integration using passive embedded substrates will be described with some design considerations.

Keywords

pastesimulationpackaging
Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 1075: Symposium J – Passive and Electromechanical Materials and Integration , 2008 , 1075-J01-03
Copyright
Copyright © Materials Research Society 2008

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References

REFERENCES

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