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Role of Film Hardness on the Polish Rates of Metal Thin Films

Published online by Cambridge University Press:  10 February 2011

S. Ramarajana ,
Y. Li ,
M. Hariharaputhiran ,
Y.S. Her  and
S.V. Babu
S. Ramarajana
Affiliation:
Department of Chemical
Y. Li
Affiliation:
Mechanical Engineering, Clarkson University, Potsdam, NY.
M. Hariharaputhiran
Affiliation:
Department of Chemical
Y.S. Her
Affiliation:
Ferro Corporation, Penn Yan, NY.
S.V. Babu
Affiliation:
Department of Chemical
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Abstract

Nanoindentation techniques were used to determine the hardness of Cu, Ta & W metal discs and thin films on silicon substrates as a function of load or indentation depth. Cu films exposed to oxidizing solutions containing H202 exhibited a higher hardness at the surface while no such change was observed for W exposed to ferric nitrate. The implication of these measurements and their relationship to chemical-mechanical polishing rates are discussed.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 566: Symposium P – Chemical-Mechanical Poilshing-Fundamentals and Challenges , 1999 , 123
Copyright
Copyright © Materials Research Society 2000

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References

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