Published online by Cambridge University Press: 07 June 2012
Understanding electromigration effects in monocrystalline metal becomes of increasing interest with decreasing width and thickness of interconnects. Using a three-dimensional, atomistic model based on the Kinetic Monte Carlo method, we investigate voids in monocrystalline silver. Subject to electromigration, voids begin to drift. We show that the drift velocity not only depends on the void size, but also on the electromigration force direction, with respect to the crystallographic orientation.