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Simulation Of Thermal Stresses, Voids And Fracture At The GaAs/Ceramic Interface

Published online by Cambridge University Press:  15 February 2011

Nickolaos Strifas  and
Aris Christou
Nickolaos Strifas
Affiliation:
Materials & Nuclear Engineering Department, University of Maryland, College Park, MD 20742 Tel (301) 405–5208 Fax (301) 314–2029
Aris Christou
Affiliation:
Materials & Nuclear Engineering Department, University of Maryland, College Park, MD 20742 Tel (301) 405–5208 Fax (301) 314–2029
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Abstract

Stresses induced at the GaAs-Al2O3 interface by large ΔT excursions have been investigated by finite element simulation and have been correlated with experimental results. The effects of power and temperature cycling on crack propagation at the die attach are investigated. The FEA (finite element analysis) method is used to simulate the effect of die attach voids on the peak surface temperature and on the die stresses. These voids in the die attach are identified to be the major cause of die cracking. It was found that stresses developed on the die because of the environmental temperature changes and their dissipation as part of an effective thermal management is necessary to ensure reliable performance.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 409: Symposium Q – Fracture-Instablility Dynamics, scaling and Ductile/Brittle Behavior , 1995 , 155
Copyright
Copyright © Materials Research Society 1996

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References

[1] Lau, J. H., “Thermal Stress and Strain in Microelectronics Packaging”, Van Nostrand New York, pp. 385–565, 1993.Google Scholar
[2] Strifas, N. and Christou, Aris, “Die Attach Adhesion and Void Formation at the GaAs Substrate Interface”, MRS, Fall 1994.Google Scholar
[3] Strifas, N. and Christou, Aris, “Failure Mechanisms, Thermal Analysis and Finite Element Modeling of Medium Band Low Noise Amplifiers”, ASME, Winter Annual Meeting, 1994.Google Scholar
[4] Strifas, N., “Die Attach Voids, Measuremcnts and Simulation”, Master's Thesis, Unriversity of Maryland, 1995.Google Scholar