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Slurry Utilization Efficiency Studies in Chemical Mechanical Planarization

Published online by Cambridge University Press:  01 February 2011

Ara Philipossian  and
Erin Mitchell
Ara Philipossian
Affiliation:
Department of Chemical and Environmental EngineeringThe University of ArizonaTucson, AZ 85721 USA
Erin Mitchell
Affiliation:
Department of Chemical and Environmental EngineeringThe University of ArizonaTucson, AZ 85721 USA
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Abstract

The residence time distribution of slurry in the pad-wafer interface was experimentally determined and used to calculate the slurry utilization efficiency (η) of the CMP process. Slurry utilization efficiency represents the percentage of slurry that actually participates in the polish by entering the region bounded between the wafer and the pad. Results show that η ranges from 2 to 22 percent, depending on operating conditions such as applied wafer pressure, relative pad wafer velocity, slurry flow rate and pad surface texture (i.e. type of pad grooving).

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 767: Symposium F – Chemical-Mechanical Planarization , 2003 , F1.4
Copyright
Copyright © Materials Research Society 2003

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